Search results for "electronica 2024"
Optimised system analysis tool for Infineon’s AURIX TC3xx MCU
By introducing version 4.7 of its Universal Debug Engine (UDE) at thisyear’s electronica trade show (hall A6, booth A16), PLS Programmierbare Logik & Systeme presents anoptimised debug, test, and system analysis tool that fully supports the internal debug functionalities ofInfineon’s new AURIX TC3xx multi-core microcontroller family without any limitation.The multi-core SoCs of the second AURIX generation were specifically designe...
VR tour opens door to Mouser warehouse at electronica
Ever wondered about the process that brings an electronic component to your workplace? Mouser Electronics will show you how at electronica (November 8-11). Visitors to its stand will be able to take a virtual reality (VR) tour of the distributor’s massive 69.677 m2state-of-the-art warehouse. Attendees will experience 3D 360-degree video displayed on Samsung Gear VR headsets. Simply by moving their heads or turning around, they will see a se...
Distributor to stage free dev kits draw at electronica
Mouser Electronics is planning a massive giveaway draw for development kits at electronica 2016 (November 8-11). Engineers can sign up at http://emea.info.mouser.com/electronica2016-contest to enter and win a high-end development kit from one of 15 key semiconductor suppliers, including Altera, Analog Devices, Atmel, Cypress, Digi, Infineon, Intel, Maxim, Microchip, NXP, On Semi, Sensirion, Silicon Labs, ST Microelectronics and Texas Instruments....
Series of common mode chokes to be showcased at electronica
Exxelia is to introduce its TCM series of common mode chokes in hallB5, booth 312 at electronica from 8thto 11thNovember in Munich, Germany. Designed and qualified to be compatible with aerospace applications, the TCM series is a cost effective solution for harsh environments.
From electronica with love
At ourbooth #667inHall A1you will have the chance to attend several live measurements and demonstrations involving our low frequency network analyzer Bode100, our dielectric material analyzer SPECTANO 100 and our precision timing solutions products. But before we provide you with more information on the demos we are proud to inform you about this year’s special guests:
Biomedical 'skin-like bandage' is durable and long lasting
A skin-like biomedical technology that uses a mesh of conducting nanowires and a thin layer of elastic polymer might bring electronic bandages that monitor biosignals for medical applications and provide therapeutic stimulation through the skin.The biomedical device mimics the human skin's elastic properties and sensory capabilities.
New 3D technologies at electronica
Exhibiting again at this year’s electronica is Beta LAYOUT, with interesting innovations to show. A highlight of Beta LAYOUT’s trade fair presence is its single-source prototyping and small-series manufacturing of 3D Mechatronic Interconnect Devices (MIDs).
M2M and IoT connectivity products introduced at electronica
Provider of Machine-to-Machine (M2M) and IoT connectivity products and services, Digi International, has announced the key company activities and events taking place during electronica. The event takes place at Messe München, Germany, 8thto 11thNovember 2016. Digi will be showcasing its solutions in hall A6, booth 528.
Wide range of innovative technology to be displayed at electronica
At electronica 2016, HUBER+SUHNER will be displaying a wide variety of radio frequency, fibre optic, high voltage, and power and data transmission solutions. Among these products will be innovations such as the SUCOFLEX 526V – which is the first product from the SUCOFLEX 500V assembly family to be shown to the public – and the Quick-Fit Plus.
'Perfecting the Art of Electronics' at electronica 2016
At the upcoming electronica show ALPS Electric will be exhibitingat hall A6, booth 421. The company will exhibit the latest products and technologies created with ALPS Electric’s original technologies for automotive, healthcare, industrial and environment and energy markets.