Search results for "photon chips"
Boundary Scan Software Platform SYSTEM CASCON automates hierarchical Test of Multi Chip Modules
GOEPEL electronic introduces new features to specially support hierarchical tests of Multi Chip Modules (MCM) as new extension of its software platform SYSTEM CASCON. The enhanced tools provide a hitherto unrivalled automation level for the generation of module and board centric Boundary Scan tests based on hierarchical library models.
New low cost Module enables full Test of DIMM168 Interfaces per JTAG/Boundary Scan
GOEPEL electronic announces the market introduction of CION Module™/DIMM168 as another I/O module of the CION product family. The new digital low cost module is serially controlled via TAP by special CION™ ASIC chips, and enables the testing of all signal and voltage supply pins of JEDEC Std. compliant DIMM168 plug connectors.
Vishay's MIL-PRF-55342-Qualified Thin Film SMD Resistor Chips Now Offer 'T' Reliability Level for Space Applications
Vishay announced that it has extended its E/H MIL-PRF-55342-qualified Thin Film surface-mount resistor chips in the 0505, 1005, 1505, 0705, 1206, and 1010 case sizes to offer a T reliability level for space applications. Qualification on larger cases sizes is pending.
Vishay Extends Resistance Range of ORN Thin Film, Molded, Dual-In-Line Resistor Networks
Vishay announced that the company has extended the resistance range of its ORN series of thin film, molded, dual-in-line surface-mount resistor networks.
Hermetically Sealed Ultra-High-Precision Bulk Metal Foil Four-Resistor Network
Vishay has announced a new ultra-high-precision Bulk Metal Foil four-resistor network that offers excellent load life, load life ratio, and shelf life stability characteristics. The hermetically sealed new SMNH resistor network features a load life stability of 0.005 % at 0.1 W per resistor at + 70 °C for 1000 hours and a load life stability ratio of 0.005 % (50 ppm).
TrenchFET Power MOSFET in MICRO FOOT Chipscale Package
Vishay has released what it says is the industry's first TrenchFET power MOSFET in the chipscale MICRO FOOT package to feature backside insulation. The Si8422DB is optimized for power amplifier, battery, and load switching in portable devices such as cell phones, PDAs, digital cameras, MP3 players, and smart phones. The 2-mil backside coating of the device insulates the top of the MICRO FOOT package to electrical shorts from being created by temp...
Vishay Siliconix MICRO FOOT N-Channel and P-Channel Power MOSFETs are Industry's First to Feature On-Resistance Ratings Down to 1.2 V in Industry's Smallest Chipscale Package
Vishay Intertechnology has introduced the industry's first p-channel power MOSFET in the industry's smallest 0.8 mm by 0.8 mm chipscale package, in addition to the first n- and p-channel devices to offer on-resistance ratings down to 1.2 V in this package size. The 8 V n-channel Si8802DB and p-channel Si8805EDB TrenchFET power MOSFETs in the MICRO FOOT package occupy up to 36 % less board space than the next smallest chipscale devices, yet offer ...
World's first multi-stream, multi-room wireless HDTV system
ProVision Communications will demonstrate AXAR2010, the world's first wireless, quad channel, multi-room HD video system at the CableLabs Summer Conference in Keystone Colorado, August 15-18.
XMOS USB Audio 2.0 reference design provides highest quality audio solution
XMOS has announced the industry's first reference design for USB Audio 2.0. The solution enables standard computer-based systems to deliver bit-perfect prosumer quality sound. Implemented entirely in software, using the XMOS XS1-L1 event driven processor(TM), the design supports hi-speed USB Audio 2.0 connectivity and up to 6 input and 6 output audio channels at 24-bit resolution and a sample rate of 192 kHz. Higher audio channel counts are als...
Mitsubishi Electric and Infineon Technologies team up to serve the global power electronics industry
Infineon Technologies AG and Mitsubishi Electric Corporation, agreed to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs. This revolutionary package concept, recently developed by Infineon Technologies, will be available with the latest generation of power chip technologies from the two leaders.