Search results for "Ethernet"

AXIOMTEK today announced the latest PICO821 Pico-ITX SBC, which supports ultra low power Intel Atom processor Z510 1.1GHz and Z530 1.6GHz at 400/533 FSB with the Intel System Controller Hub US15W. The PICO821 is an incredibly small 10 x 7.2 cm embedded board based on Pico-ITX form factor, the world's smallest x86 embedded board. Instead of built-up a full set of I/O connectors soldered onto the board edge, the PICO821 provides internal connectors...

Spirent Communications plc, in its continuing role as a leader in network, services and device testing, played a critical part in the industry’s first live interconnection carrier Ethernet demonstration conducted at the Ethernet Expo: Europe 2009 Conference and Expo.

Spirent Communications plc announced it exclusively powered the testing of the Carrier Ethernet Global Interconnect demonstration conducted by EANTC and co-organized by ancotel to validate Carrier Ethernet service interoperability across eight European service providers including Belgacom ICS, Equinix, Expereo International, Level3 Communications, P&TLuxembourg, Teragate, Tinet, and Ucomline.

Spirent Communications, a global leader in networks, devices and services testing, today introduced Spirent TestCenter Mobile Backhaul to ensure that Ethernet in the mobile backhaul network can deliver carrier grade performance. Designed to support 3G/4G mobile environment, Spirent TestCenter improves test cycle times and reduces the overall cost of testing while ensuring that service quality in the Ethernet backhaul goes beyond “best effort.â€...

In an effort to validate the Metro Ethernet Forum’s External Network-to-Network Interface (ENNI) inter-working across network operators worldwide, the Carrier Ethernet Global Interconnect demonstration conducted by EANTC and co-organized by ancotel used Spirent solutions to test interconnectivity, interoperability and service provisioning. Showcased this week at Light Reading’s Ethernet Expo Americas 2010 conference in New York, the demonstra...

ADLINK Technology, Inc., a leading provider of machine vision platforms and boards, announced the release of the EOS-1000, the industry's first compact vision system based on the Intel® Core™2 Duo P8400 processor. The EOS-1000 provides four independent PoE (Power over Ethernet) ports with data transfer rates up to 4.0 Gb/s and combines high computing power and multi-camera imaging—ideal for applications such as 3D vision robotic guidance.

ADLINK Technology announced the Express-CB, the newest member of the ADLINK Computer-on-Module (COM) family. The Express-CB is a COM Express™ Type 2 module supporting the 64-bit Intel® Core™ i7 / i5 processor with CPU, memory controller, and graphics processor on the same chip. Based on the latest Mobile Intel® QM57 Express chipset, the Express-CB is specifically designed for customers who need high-level processing and graphics performanc...

ADLINK Technology presents the Express-ATC and Ampro by ADLINK Express-ATR, two low-power, long-lifecycle computer-on-modules (COMs) based on the cost-effective, ultra low power Intel® Atom™ processor N270 and Mobile Intel® 945GSE Express Chipset and supporting up to 2 GB of DDR2 533MHz memory on a single SODIMM socket. The Express-ATC and Express-ATR are Compact COM Express™ modules measuring only 95 x 95 millimeters, and are fully compati...

ADLINK Technology, Inc. has announced the Express-ATC, the newest member of its Computer-on-Module (COM) family. The Express-ATC is a Compact COM Express module measuring only 95 x 95 millimeters, and is fully compatible with the Type 2 pin-out of the PICMG COM Express specification. This highly integrated Compact size COM Expressâ„¢ module is an off-the-shelf building block that is ready to plug into custom-made, application-specific carrier boa...

ADLINK Technology announced availability of a high-reliability Intel® Atom™-based rugged system. The Ampro by ADLINK™ RuffSystem™ 735 integrates a high-efficiency processor, RAM, graphics, networking, serial I/O, and PC/104-Plus expansion into an Extreme Rugged™ enclosure, capable of operating in extreme temperatures at full CPU speed.