Search results for "geometry"

Autodesk today unveiled Autodesk Simulation 360—a comprehensive set of tools delivered securely in the cloud with a pay-as-you-go pricing model that enables any company to make simulation part of their everyday design and engineering processes.

Working in collaboration with a partner company, Schroff has developed a self-adhesive fabric gasket with a triangular profile that has been granted a patent by the European Patent office. Specifically designed for narrow gaps, the new gasket profile is now being used on shielded versions of Schroff’s range of AdvancedMC modules, which are compatible with both AdvancedTCA and MicroTCA systems.

LEM has announced the introduction of the first AC current sensors family of components based on patent-pending Perfect Loop Technology. After calibration, the new RT series achieves absolute accuracy of better than 0.65% - including the position error - making them the first split-core Rogowski coils to be suitable for use in Class 1 power devices.

Toshiba will reinforce its leadership in the development and fabrication of high density NAND flash memory when it starts shipping NAND flash memory products fabricated with 32nm process technology. Samples of the world’s first 32nm generation, 32-gigabit single chips, offering the largest density of any NAND flash chip, are available from today, and 16Gb chip products, the current mainstream density, will be available in July in Japan. The...

Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that its well-established ECON contactor once again has proven its superior cost of test. The contactor recently exceeded 4.5 mio insertions at an Asian test house.

ANSYS has launched the newest release of its engineering simulation technology suite, ANSYS 14.0. Designed to optimize product development processes, ANSYS solutions reduce the time and cost needed to foster product innovations.

Agilent Technologies Inc.today announced the launch of a series of 30-second demos on 10 popular microwave EDA usability innovations for its Advanced Design System software, the industry’s leading electronic design automation software for RF, microwave and high-speed applications. The innovations further enhance the software’s ease of use, while improving the overall productivity of today’s RF and microwave engineers.

The already extensive range of Binder Series 768 M8 connectors has been enhanced with the introduction of a new version that has screw terminations with improved contact geometry and pin number markings that simplifies termination of the screw contacts.

STMicroelectronics has introduced a chipset that couples STs new multimedia application processor with a companion audio and power-management chip. This powerful platform raises the bar in mobile multimedia, enabling smart phones and other portable devices to record and share high-definition video clips, receive mobile TV, playback days of hi-fi music and deliver a state-of-the-art 3D gaming experience.

Ohmite Manufacturing announces Wakefield Solutions’ 19000 Series radial-fin heat sink extrusions for LED light engines. Developed in conjunction with an engineering team from a leading LED manufacturer, the 19000 Series is designed to help LED engineers meet both space constraints and operating parameters. With a low-cost, lightweight aluminum profile, the 19000 series offers maximum thermal performance that makes matching the right heat si...