Search results for "SEMICON Europa"

On SMT production lines equipped with ASMPT hardware and software, program changes can be executed fully automatically, even in the absence of a barcode reader, by transmitting the data of the respective Printed Circuit Board (PCB) from one machine to another via a standardised interface.

SEMI, the industry association serving the global electronics design and manufacturing supply chain, has applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support four new Intel Corporation semiconductor manufacturing sites in the states of Arizona, New Mexico, Ohio, and Oregon.

Synopsys has announced that it has completed the acquisition of Intrinsic ID, a provider of Physical Unclonable Function (PUF) IP used in the design of system-on-chips (SoCs).

e-peas, a pioneer in ultra-low power management for energy harvesting, has announced the closing of a new round of €17.5 million funding, led by Otium Capital.

Innoscience firmly denounces the accusations made by Infineon Technologies ina recent patent infringement lawsuitagainst three Innoscience entities.

The MF420 single-phase chassis mount EMI filter family available now from global EMC solutions provider EMIS offers systems designers a small footprint device suitable for use in compact equipment such as home appliances and a wide range of electronic equipment.

Avnet Silica will host a series of live demonstrations under the umbrella theme of “The engineers of evolution” at embedded world 2024 in Nuremberg (April 9 – 11).

In the consumer device world, the Matter protocol is exciting huge interest because it holds out the promise – finally – that all smart devices in the home can respond to commands from a single controller or app.

In an era where seamless connectivity and real-time data exchange are paramount, scientists at the University of Florida have introduced a method to shakeup wireless communication through the development of three-dimensional processors.

Global 300mm fab equipment spending for front-end facilities is forecast to reach a record $137 billion in 2027 after topping $100 billion for the first time by 2025 on the strength of the memory market recovery and strong demand for high-performance computing and automotive applications, SEMI highlighted in its quarterly300mm Fab Outlook Report to 2027 report.