Search results for "SEMI"
MacDermid Alpha boosts semiconductor reliability at IMAPS 2024
MacDermid Alpha Electronics Solutions, a pioneering supplier of integrated materials and chemistries to the electronics industry, is participating at the IMAPS 20th Annual Device Packaging Conference, Arizona 18–21 March 2024.
Microprocessor market size worth $142 billion in 2032
Theglobal microprocessor industry is experiencing rapid growthand serves a vital function in various sectors such as consumer electronics, automotive, healthcare, and telecommunications.
Infineon introduces CoolSiC MOSFET G2
Infineon Technologies AG is heralding a new era in power systems and energy conversion with the introduction of its advanced silicon carbide (SiC) MOSFET trench technology.
Semidynamics puts the power of full core customisation into hands of customers
Semidynamics has unveiled its latest innovation, the ‘Configurator,’ a tool designed to empower customers with the capability to fully customise a RISC-V processor core.
Optimally adapted solutions for cleaning tasks
As an essential step in manufacturing processes, parts cleaning significantly contributes to high product quality and adds considerable value. Therefore, almost all industrial sectors are confronted with more stringent particulate and film-type cleanliness specifications.
North Korean cyber espionage targets South Korean semiconductor firms
Recent reports from South Korea's National Intelligence Service (NIS) have revealed a concerning trend of cyber espionage, with North Korean hackers infiltrating South Korean semiconductor manufacturers.
KYOCERA AVX releases new range of load dump varistors
KYOCERA AVX has released the new range of load dump varistors as an extension of its trusted TransGuard Automotive Series.
DELO adds new adhesive for biosensors
DELO has developed a new medical-grade adhesive, DELO MONOPOX MG3727, as it continues to grow within the medical electronics industry.
Indium to showcase semiconductor innovations at IMAPS
Indium Corporationwill feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaginghosted by IMAPS, 18–21 March 2024, in Fountain Hills, AZ.
Wise-integration raises €15M for global GaN solutions
Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN ICs for power supplies, has announced financing of €15 million.