Search results for "Lane Electronics"

In a significant stride for semiconductor technology, a team led by Professor Yong-Young Noh from the Department of Chemical Engineering at Pohang University of Science and Technology (POSTECH) has developed a new tellurium-selenium composite oxide semiconductor material.

SHENMAO Technology is pleased to offer its PF606-P276 ultra-low void no-clean zero-halogen lead-free solder paste.

Arrow Electronics is strengthening support for customers seeking to accelerate their embedded applications with artificial intelligence and machine learning by launching Arrow Edge AI engineering services.

HBK is pleased to announce the Load Cell Measurement Chain (LCMC), an innovative customisable solution enabling users to adapt their measurement system to their unique requirements and install it following the plug & play principle.

Würth Elektronik is exhibiting at PCIM Europe in Nuremberg, June 11-13, 2024. The manufacturer will present electronic and electromechanical components in Hall 6, Booth 342.

On 17th April 2024, Gunnar Rasmussen, a pioneer in the acoustics industry and founder of GRAS Sound and Vibration, died in Holte (Denmark).

Alliance Memory announces that it has expanded its offering of high-speed CMOS mobile low-power SDRAMs with new 16Gb and 32Gb LPDDR4X devices that combine low power ratings with increased clock speeds and data rates in the 200-ball FBGA package.

Keysight recently held a webinar titled: “Overcoming Design Challenges in the Era of Wide Bandgap Semiconductors,” in which valuable insights on the trends and challenges of power electronics were explored.

Yamaichi Electronics has introduced new crimp contacts with diameters of 1.6 and 2.0mm for its Y-Circ P Push-Pull circular connectors.

SureCore, the ultra-low power embedded memory specialist, has announced the successful tape out of the next key part of the Innovate UK (IUK)-funded project‘Development of CryoCMOS to Enable the Next Generation of Scalable Quantum Computers’.