Search results for "ai safety summit"

NFC Forumhas announced the winners for the 2024 edition of its Innovation Awards. More than 60 entries to the Innovation Awards were submitted from around the globe, with the top ten finalists determined by a panel of experts.

TDK Corporation has announced the launch of its latest i1C series DC-DC converters under the TDK-Lambda brand. Designed in the standard 1"x1" package, these 200W non-isolated buck-boost converters deliver both step-up and step-down voltage conversion. Operating from input voltages of 9 to 36V or 18 to 75V, the i1C series offers output voltage ranges adjustable from 9.6V to 28V, with a maximum current capacity of 10A.

TrustInSoft recently announced the release of TrustInSoft Analyzer 2024.10 (TISA), featuring a range of new and enhanced capabilities that streamline the software testing process.

OMNIVISION has announced that its complete camera system, featuring the OG02B10 colour global shutter (GS) image sensor and OAX4000 ASIC image signal processor (ISP), is now verified and compatible with the NVIDIA Holoscan sensor processing platform and the NVIDIA Jetson platform, which is designed for Edge AI and robotics.

Arteris, Inc. announced an innovative evolution of its network-on-chip (NoC) IP products with tiling capabilities and extended mesh topology support for faster development ofartificial intelligence (AI)and machine learning (ML) compute in system-on-chip (SoC) designs.

OMNIVISION and Philips will jointly demonstrate a prototype of the world’s first in-cabin connectedwellbeing monitoring solutionat AutoSens Europe, taking place 8-10thOctober, 2024, at Palau de Congressos, Barcelona, Spain.

The cancellation ofApple’s project beginning of 2024 has shaken confidence in microLED technology, leaving the industry at a critical juncture. As delays continue and OLED advances, microLED’s value proposition is shrinking.

Farnellhas introduced the newRaspberry PiAI Camera, the latest innovation from Raspberry Pi that expands Farnell’s range of artificial intelligence devices.

MediaTek has introduced the Dimensity 9400, its latest smartphone chipset, designed specifically for optimisingEdge-AI applications. Managing Editor Paige West attended a press talk to learn more.

Omron Electronic Components Europe has introduced the G7EB-E2 high-power PCB relay, an advanced version of the G7EB series.