Search results for "Master Bond"
Power system-in-package boost efficiency
The latest MasterGaN2 device from STMicroelectronics is an advanced power system-in-package that integrates a gate driver and two enhancement mode GaN transistors in asymmetrical half bridge configuration.
UV adhesives improve integration of holographic films in AR HUDs
DELO has developed DELO PHOTOBONDUV acrylates for optoelectronicsthat enable fast and true-colour bonding of holographic films manufactured by Covestro.
Indium to present on e-Mobility at SMTA Rocky Mountain
Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Rocky Mountain Expo & Tech Forum.
More safety in medical technology with Rehm dispensing systems
Increasing cost pressure in medical technology is causing a change from manual small series production to a fully automated process.
Palomar Technologies offers free webinar
Palomar Technologies has announced they are offering a webinar discussing the differences between ball bonding and wedge bonding.
NXP’s Kurt Sievers to lead ESIA as President
The General Assembly of the European Semiconductor Industry Association (ESIA) have confirmed Kurt Sievers of NXP Semiconductors, as the new ESIA President.
Foiling vessels production increased due to investment
Candela has announced it’s raised €24m, led by EQT Ventures, with participation from existing investor Chris Anderson, the Curator of TED. The new capital will boost the company’s already substantial cash influx from sales and will be used to triple R&D, invest in production automation and scale up the sales organisation to meet demand for Candela’s electric leisure and commercial vessels worldwide.
Improving EV thermal conductivity at EV & hybrid vehicle expo
At this year’s Electric and Hybrid Vehicle Technology Expo and Battery Show, ESI Automotive will showcase how new technologies, such as silver sintering can help automotive OEMs achieve up to six times greater thermal conductivity of a die bond in the inverter of an electric vehicle.
Lyndsay Quinn newly appointed by Atlas Copco
Atlas Copco has appointed Lyndsay Quinn as Business Line Manager for Operations within its Compressor Technique Service (CTS) division in the UK.
Wafer-Level Packaging Symposium: Indium Corporation
Indium Corporation’s innovative materials for advanced semiconductor packaging will be the focus of a presentation byDr. Dongkai Shangguan, strategic advisor, at the Surface Mount Technology Association’s Wafer-Level Packaging Symposium, Feb. 15-17, San Jose, Calif., U.S.