Search results for "Stanford University "
Plessey EPIC Sensor wins IET Award
Plessey Semiconductors’ Electric Potential Integrated Circuit sensor won the IET “Measurement In Action” Award at the IET Innovation Awards Gala Dinner held on 9th November 2011 at the Intercontinental Hotel, London. Organised by the IET (The Institute of Engineering and Technology), the award was presented to Plessey Semiconductors and the Department of Engineering and Design at the University of Sussex, who did the original research.
Cisco Senior Vice President of Engineering Pankaj Patel Joins eASIC Board of Directors
eASIC Corporation, a provider of NEW ASIC devices, today announced that Pankaj Patel, Cisco Senior Vice President of Engineering has joined eASIC’s Board of Directors.
Scott S. Cramer Appointed by Magnetek
Magnetek announced the appointment of Scott S. Cramer as Vice President, General Counsel and Corporate Secretary. Mr. Cramer will succeed Vice President Legal Affairs and Corporate Secretary, Ms. Jolene Shellman, who is retiring from the Company.
Magma Appoints Noriaki Kikuchi President of Japanese Subsidiary
Magma Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, announced today it has named Noriaki Kikuchi president of Magma KK, Magma’s Japanese subsidiary. Kikuchi, with more than 30 years experience in electronic design automation and other technology industries, reports to Magma President and Chief Operating Officer Roy E. Jewell.
Magma Names Maggie Chen to Head Taiwan Operations
Magma Design Automation Inc today announced the appointment of Maggie Chen as country manager for the company's Taiwan operations. Chen reports to Charlie Shin, Magma’s vice president of Asia-Pacific Sales. “Maggie brings a great combination of managerial and sales achievement and I expect her experience will help our Taiwan team achieve even greater success,” Chin said. Taiwan is a key market for Magma and I anticipate that Maggie will con...
Molex Interconnects Power UMsolar Car on 1,800 Mile Australian Outback Journey
Molex Incorporated has provided support to the University of Michigan Solar Car team (UMsolar) in its bid to win the 2011 World Solar Challenge. The UMsolar team’s car, named Quantum, features several electronic components from Molex, as well as a variety of solderless terminals.
MARTIN to Demonstrate Standalone QFN Solder Bumping and BGA Reball Unit at SMTA Capital Expo
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.
FCT Assembly Promotes Robert Dervaes to VP of Technology for Its Solder Division
FCT Assembly announces the promotion of Robert Dervaes to VP of Technology and Engineering for its Solder division, FCT Solder. Robert has spent the past 12 years working as the VP of Technology and Engineering for Fine Line Stencil, a division of FCT Assembly.
Cambridge Wireless and Univ. Of Cambridge Eiffel Project announces master class in Wireless Sensing.
The Cambridge Wireless Sensing SIG in conjunction with the Univ. Of Cambridge Eiffel Project will be uncovering the secrets to success in Wireless Sensing. This half day free event will be taking place at the Computer Labs, University of Cambridge on the 7th April 2011, and is supported by the Discovering Start-Ups Project, an initiative funded by EEDA to support and showcase start up companies.
ESI will speak at the 6th International Styrian Noise, Vibration and Harshness Congress in Graz, Austria
The International Styrian Noise, Vibration and Harshness (ISNVH) Congress is the annual European Automotive Noise Conference for Noise, Vibration and Harshness (NVH) experts to discuss the possibilities and existing achievements in vehicle NVH. Organized by the Virtual Vehicle Research and Test Center in cooperation with AVL, MAGNA STEYR and the American Society of Automotive Engineers (SAE), the 6th ISNVH Congress will be held June 9-11, 2010 at...