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Science Secretary Peter Kyle welcomed the launch of the Sentinel-2C satellite, which lifted off successfully on 5th September at 02:50 BST from Kourou in French Guiana.

Selectivesolderingof assemblies on panels is generally straightforward, but when working with large panels containing tall components, the task becomes more complex.

The electric vehicle (EV) industry has been dealt another blow, as car manufacturer Volvo has slashed its target of making solely EVs by 2030, as it said some vehicles by that date will be hybrid, too.

Following his achievement of the 2024 Millennium Technology Prize, Electronic Specifier recently spoke with the inventor of the IGBT, Professor Bantval Jayant Baliga, on what it means to him and what he hopes to see in the future.

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are used to create tinyelectrical connectionsbetween a semiconductor chip and other components.

Nordic Semiconductor has announced the availability of its smallest and lowest power System-in-Package (SiP) - the nRF9151, and its associated nRF9151 Development Kit (DK).

Rimac Energy, a pioneer in highlyintegrated battery energy storageand power delivery systems, has announced that its first SineStack is now ready for deployment to a site in Colchester, UK.

Rimac Energy, a pioneer in highlyintegrated battery energy storageand power delivery systems, has announced that its first SineStack is now ready for deployment to a site in Colchester, UK.

PCIM Asia2024, Asia’s leading international platform for communication and exchange in power electronics, intelligent motion, renewable energy and energy management, concluded on 30th August 2024 at the Shenzhen World Exhibition and Convention Centre in China.

SEC Glasgow to welcome global leaders to explore new frontiers at the biggest space industry event ever held in Scotland, 11 – 12 September.