Search results for "geometry"

The collaboration builds on extensive work done at 14-nm and several other process geometries, and will calibrate Synopsys’ Sentaurus TCAD models to support the next-generation FinFET devices. The collaboration will include 3-D modeling of new device architectures and materials that will enable the semiconductor industry to continue to deliver products with higher performance and lower power consumption.

Energy-saving electric drives with reduced-friction bearings Throughout industry, there is a growing focus on the energy efficiency of electrically powered machinery and equipment. The chosen bearings also affect energy consumption.

Molex Incorporated announces the introduction of its next-generation HSAutoLink II Interconnect System. Delivering on the automotive industry’s need for multiple high-speed media protocols, the HSAutoLink II Interconnect System meets all these demands in one system. Typical applications include in-vehicle infotainment, telematic devices, radio and navigation systems, as well as meeting the rising demand for advance drive assist cameras used...

The newly developed LinScan scanner technology from Fraunhofer IPMS opens up new possibilities for laser scanners and laser projectors. This new driving scheme allows switching of the target positions of the laser beam quickly, and a dynamic adjustment of the scanning speed is also possible. 3D cameras or miniaturized laser projectors equipped with this technology offer higher resolution and make innovative solutions possible, such as robot eyes ...

Cadence Design Systems announced today the tapeout of a 14-nanometer test-chip featuring an ARM Cortex-M0 processor implemented using IBM’s FinFET process technology. The successful tapeout is the result of close collaboration between the three technology leaders as they teamed to build an ecosystem to address the new challenges from design through manufacturing inherent in a 14-nanometer FinFET-based design flow.

Vero Software have announced the release of their Mould & Die focused product VISI 20. After a successful series of Customer Update seminars running throughout October, VISI 20 is now available for general distribution. Version 20 is a substantial release introducing many new features in all areas of the product with continued emphasis on solutions for mould, tool and die makers.

A new website to help engineers accelerate and improve the design of electrical power transformers and AC line reactors has been launched by Cobham Technical Services. Designed to be a useful resource for engineers seeking to optimise the performance of power transformers or reactors the new website - http://transformer-design-software.com - provides clear insight into the benefits of automating the design process using finite element modelling,...

New developments in the 2013 release of the world’s most powerful sheet metal CAD/CAM software, Radan, provide considerably improved support for multi-tools, meaning they are much easier to use. Radan General Manager Chris Aston says the traditional way of setting up multi-tools in the machine system data file is cumbersome and time-consuming. However, a major concept change in Radan 2013 provides considerable support for multi-tools.

Sandvik Coromant, is introducing two new concepts for productive deep hole drilling operations specific to large hole diameters, the CoroDrill 801 and CoroDrill 818. CoroDrill 801 is designed to support secure drilling processes in materials that are difficult-to-chip.

As more technology moves to the cloud, online application engineering environments are paving the way towards the rapid and collaborative development of complex semiconductor products. By Dr. Uwe Knorr, VP of Marketing & Sales with Transim Technology.