Search results for "Toshiba"

32 devices, designed to save space and reduce losses in synchronous rectification, have been announced by TEE. The 32 devices will be added to the company's existing UMOS VIII-H ultra-efficient MOSFET family and reduce space and losses in not just synchronous rectification, but in primary and secondary side switching applications and other high-speed designs requiring device ratings from 60V to 250V.

Combining high-speed communication with low power consumption, the TLP2361 and TLP2161 photocouplers have been introduced by Toshiba. Suitable applications for the devices include use in factory networking, high-speed digital interfacing for instrumentation and control devices, and I/O interface boards.

A bluetooth starter kit designed to speed up dual mode development has been announced by TEE. The starter kit (BMSKTOPASM369BT) enables users of TEE's TC35661SBG-501 (“Chiron-501”) Dual Mode Bluetooth IC (BT 4.0) to develop their designs quickly.

Designed for power management applications in mobile devices, the SSM6N58NU low-resistance dual N-channel MOSFET meets the needs of high current as well as wireless charging circuits used in smartphones, tablets and laptops. Toshiba Electronics Europe's latest MOSFET ensures efficiency and switching speeds through a design that minimizes ON resistance (RDS(ON)) and input capacitance (CISS).

Focusing on patents in the emerging non-volatile memories market, Yole Développement’s partner, KnowMade, has released the "Emerging Non-Volatile Memories: patent landscape” report. This builds on the information from last year's Yole report: “Emerging Non-Volatile Memories”.

Focusing images after a photo has been taken is now a possibility with the introduction of Toshiba's dual camera module. Claiming to be the industry's first dual camera module to incorporate twin 1/4 inch optical format 5 megapixel CMOS camera modules (5 megapixels x 2 arrays), the TCM9518MD is able to simultaneously output recorded images and depth data. TEE has started sample shipments of the dual camera module, which is designed for use in sma...

Enabling faster wireless charging of mobile devices, the enhanced TB6865FG power transmitter and TC7763WBG receiver chipset from Toshiba Electronics Europe as been made available. Supporting 5W power transfer and compatible with the QI standard 1.1, the chipset also features a rigorous Foreign Object Detection function and an integrated digital logic controller that reduces component count and minimizes design complexity.

At Embedded World 2014, Toshiba will be demonstrating a Digital Kiosk which combines TransferJet, NFC and Qi wireless charging technology. In this example use case rich digital content, including HD video, can be quickly purchased and downloaded to mobile devices, such as smartphones.

Held on March 18-20, 2014 in the 57,500 square meters of halls W1, W2, W3, W4 and W5 at Shanghai New International Expo Center, the 13th electronica China and productronica China will feature more than 800 exhibitors unveiling the latest technology products and solutions including automotive electronics, power, embedded, medical, industrial electronics and more.

The 2014 edition of IC Insights’ McClean report provides a ranking of the industry’s 10 largest IC manufacturers in terms of installed capacity. This top 10 list features four companies from North America, two companies from South Korea, two from Taiwan, and one each from Europe and Japan.