Search results for "SiC MOSFET"

SICK has announced the launch of its MPB10 Multi-Physics Box condition monitoring sensor, a rugged bolt-on device designed to deliver real-time, continuous service data from industrial machines, including electric motors, pumps, fans, and conveyor systems, even in the harshest industry environments.

At electronica 2022, on the Digi-Key booth, Caroline Hayes speaks with Michael Maurer, Senior Application Marketing Manager at ROHM Semiconductor about QuiCur and Nano Cap technologies / BD9S402MUF-C.

Although GaN and SiC technology and products dominated the power industry show which returned to Nuremberg in May, it was not to the exclusion of all other power technology. The industry has clearly been active even during lockdown and jumped at the chance to show real-life people the progress made.

Extensive lineup of MOSFETs, optical isolation, transistors, and diodes, to cover various automotive applications in 12V to 48V battery systems. In addition, Toshiba offers automotive-grade motor control drivers.

Power Integrations, the high-voltage integrated circuits for energy-efficient power conversion, has announced a high-current member of its LinkSwitch-TN2Q automotive switcher IC family which provides up to 850 mA of output current without the need for metal heatsinking.

The TCAN1463-Q1 is a high-speed Controller Area Network (CAN) transceiver that meets the physical layer requirements of the ISO 11898-2:2016 high-speed CAN specification and the CiA 601-4 SIC specification. The device supports both classical CAN and CAN FD (flexible data rate) data rates up to 8 Megabits per second (Mbps).

Infineon Technologies AG and II-VI Incorporated (Nasdaq: IIVI) have signed a multi-year supply agreement for silicon carbide (SiC) wafers.

SICK and MVTec Software are deepening their strategic cooperation.Algorithms of MVTec's HALCON machine vision software will be integrated into SICK's sensors. The corresponding agreement was signed by Dr. Martin Schenk, Senior Vice President Product Management SICK, and Dr. Olaf Munkelt, Managing Director MVTec Software, at the SPS trade fair in Nuremberg on the 9th November.

The TPS22992x product family consists of two devices: TPS22992 and TPS22992S. Each device is a single-channel load switch with an 8.7-mΩ power MOSFET designed to maximize power density in applications up to 5.5 V and 6 A. A configurable rise time provides flexibility for power sequencing and minimizes inrush current for high capacitance loads.

Cambridge GaN Devices (CGD), a semiconductor company that develops a range of energy-efficient GaN-based power devices to make greener electronics possible, will participate for the first time at electronicawhere the company will take part in the conference proceedings as well as show GaN devices and discuss strategic partnerships.