Search results for "AMD"
Network Platform featuring AMD G-Series Processor with Fanless, Low-level Operation
Axiomtek unveils its new fanless, slim-type network appliance platform, the NA-110, built on AMD G-series APU T24L 1.0GHz with A50M chipset. The low-power NA-110 comes in a small package with a height of just 30mm and a weight of 2.2kg, which can easily fit into any confined space and harsh environment. It offers up to 4GB of DDR3 SO-DIMM RAM, one PCI Express Mini Card expansion, CFast socket, 2.5“ SATA HDD, four gigabit Ethernet ports, and dua...
AMD's SeaMicro SM15000 Server for Big Data and Cloud
AMD has revealed the SeaMicro SM15000 server, another computing innovation from its Data Centre Server Solutions group. AMD's SeaMicro SM15000 server revolutionizes computing with the invention of Freedom Fabric Storage, which extends its Freedom Fabric beyond the SeaMicro chassis to connect directly to massive disk arrays, enabling a single ten rack unit system to support more than five petabytes of low-cost, easy-to-install storage.
Profits at Stake in IC Foundries’ Push for Leading-Edge Technology
Before GlobalFoundries entered the IC foundry market, TSMC was by far the technology leader among the major pure-play IC foundries. In 2012, about 37% of TSMC’s revenue is expected to come from ≤45nm processing. As expected, with GlobalFoundries’ fabs producing AMD’s MPUs over the past few years, its processing technology is skewed toward leading-edge feature sizes.
TE Connectivity Develops LGA 1944 Socket For AMD’s New High-Performance Opteron 6000 Series Server Processor
TE Connectivity (TE) announces a new surface-mount LGA socket for AMD's new high-performance Opteron 6000 series server processor. The LGA 1944 socket is validated to the processor’s high speed/ high performance specification. TE is one of the few suppliers able to provide this kind of technology and products.
Innovative Silicon named a top finalist in Swiss Economic Forum Awards
Innovative Silicon, Inc. (ISi), developer of the Z-RAM zero-capacitor floating body memory technology, today announced that it was one of the top finalists in the Swiss Economic Forum’s 2008 Awards. Now in its 10th year, the Swiss Economic Forum is a two-day gathering of 1200 leading figures from industry, commerce, politics and academia. Held on May 22 and 23 in Thun, Switzerland, the event provided a discussion forum for international busine...
DSL gets Silver from Microsoft
Datasound Laboratories (DSL), a leading provider of single board and embedded computing solutions, has been awarded Microsoft® Silver OEM (Original Equipment Manufacturer) Hardware Competency status. The Silver Competency certification is part of the Microsoft Partner Network program and reflects DSL’s level of Microsoft expertise and training as well as its commitment to develop and market packaged software solutions based on Microsoft techno...
picoChip compiler for multi-core devices receives GCC acceptance
picoChip’s C compiler has been accepted as an official port for the GNU Compiler Collection (GCC). The compiler is part of a suite of tools developed to support picoChip’s multi-core picoArray devices.
Innovative Tensilica-Based Products on Display at CES 2008
Tensilica, Inc. today announced that over 30 companies that either license Tensilica’s popular processor cores or use merchant market semiconductor products that include Tensilica’s cores will be displaying products at this week’s International Consumer Electronics Show (CES). These Tensilica-enabled products include some of the most advanced, innovative consumer devices, including LCD TVs, cellular phones, WiFi-enabled notebook computers, ...
Low power PC/104+ embedded motherboard from Anders has integrated CAN
The SBX-iGLX embedded computing platform from Anders Electronics combines a PC/104+ modular architecture with CAN bus connectivity, Ethernet connections, PCMCIA and CardBus interfaces to deliver flexible expansion options for industrial applications. Using the new platform, developers can create cost-effective and compact embedded computer configurations with feature sets tailored precisely to their needs.
National Instruments Appoints Senior Vice President of Research and Development
National Instruments today announced the appointment of Phil Hester to the position of senior vice president of R&D. Hester brings 30 years of technology industry knowledge and technical expertise to NI.