Search results for "fibre optic"

Teledyne FLIR explores the reasons why thermographers need training, especially as devices become more accessible.

Review Display Systems (RDS) has announced the availability of a range of immersive Near Eye Display (NED) modules. A range of high-performance micro-OLED and micro-LCD displays featuring ultra-high resolution, high brightness, high contrast and low power consumption are available in NED module solutions.

onsemi has launched the Hyperlux LP image sensor family. It targets fast growing markets including industrial and commercial cameras such as smart doorbells, security cameras, AR/VR/XR headsets, machine vision and video conferencing.

The space industry is shifting its connectivity interfaces from traditional dedicated networks to Ethernet solutions that provide added flexibility and simplify the design process.

Huntsman is announcing the development of innovative polyurethane, carbon nanotube, and epoxy materials at The Battery Show this week, which are all designed to help improve the integration of batteries into electric vehicles and enhance their protection and performance.

The UK will play a crucial role in a landmark mission to trace patterns in the light from space, looking back almost to the Big Bang, bringing us closer to understanding the nature of our Universe and how it began.

Smiths Interconnect has announced the launch of its new AT Series of RF chip attenuators from DC to 20GHz.

Fluke is making this offer in recognition of the increasing preference to use fibre optics for mission-critical links in data centres, networks serving campuses over long distances and backbones in and between buildings. This substantial expansion of the fibre optics market has made it more crucial than ever that users choose the correct fibre test and troubleshooting solution for their installation.

Current industry trends, new technological developments, and exchanges among professional colleagues were unmistakably in the centre of what was taking place at the Viscom AG campus in Hanover, Germany, in September 2023.

Advanced packaging of semiconductor-based sensors brings very specific interconnection requirements.