Search results for "ai safety summit"
Innovative bonding technologies for AI and electromobility
electronica 2024, one of the world’s most important trade fairs for electronics being held from 12–15 November 2024, will once again bring leading experts, users, and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C3, Booth 300.
NXP Ethernet switches enables vehicle networks
NXP Semiconductors has unveiled its new S32J series of high-performance Ethernet switches and network controllers.
Piezo haptic driver enables tactile feedback to HMIs
The BOS1211 CapDrive piezo haptic driver from Boréas Technologies are in stock at authorised distributor Mouser Electronics.
DP83TC817S-Q1 by Texas Instruments
The DP83TC817-Q1 device is an IEEE 802.3bw automotive Ethernet physical layer transceiver. The device provides all physical layer functions needed to transmit and receive data, and xMII interface flexibility. DP83TC817-Q1 is compliant to Open Alliance EMC and interoperable specifications over unshielded single twisted-pair cable.
AC/DC & DC/DC controllers (external FET) by Texas Instruments
Optimise power conversion with our controller products, covering a wide range of isolated and non-isolated power topologies. We offer one of the world's largest comprehensive portfolios of high-performance AC/DC and DC/DC controllers with the widest range of power topology options.
VAP Group to host second edition of Global AI Show in Dubai
VAP Group has announced the second edition of the Global AI Show, taking place on December 12 and 13, 2024 at the Grand Hyatt Exhibition Centre, Dubai.
Three ways to stop cyber criminals targeting patient data
The Health Sector Cybersecurity Coordination Centre (HC3) hasissued a warningto healthcare providers about the Trinity Ransomware group, which has frequently targeted organisations in both the US and the UK.
SHENMAO introduces PF719-P250A solder paste
SHENMAO has announced the launch of its special solder paste, PF719-P250A, specifically designed for power management modules in AI substrates.
How squib and contactor drivers help improve safety and efficiency in HEV/EV battery disconnect systems
Power distribution in battery management systems (BMS) for hybrid electric vehicles (HEV) and electric vehicles (EV) delivers power to core functions of the vehicle while also providing mechanisms to safely disconnect high voltage or high current events.
New G6RN-E 10A relays from Omron
Omron Electronic Components has extended its relay portfolio with the introduction of its G6RN-E, for heat pumps, smart building, factory automation and energy applications.