Search results for "Master Bond"
Why semiconductor recovery takes time
There’s been no easing of the shortage of some semiconductor devices over the last eighteen months, as the headlines in the industry trade media attest. In this article, Adam Fletcher, chairman of the Electronic Components Supply Network (ecsn) provides an explanation of why it takes so long for chip manufacturers to put their supply networks back in balance.
Compound offering easy plating with LDS for 5G antennas
SABIC, of the chemical industry, introduced LNPTHERMOCOMPOFC08V compound, a material well suited for 5G base station dipole antennas and other electrical/electronic applications.
PCX elongated thermoelectric coolers speed up PCR testing
Thermal Cycling devices used for Real-Time PCR utilise thermoelectric technology to precisely manage temperature set points and ramp rates, enabling amplification of DNA segments.
PowerCycling PCX elongated thermoelectric coolers
The PowerCycling PCX Elongated Series offers a robust module construction with high reliability in thermal cycling applications...
Anritsu showcase 5G solutions at MWC 2022
Anritsu Corporation, a global provider of innovative test and measurement solutions for advanced and converged networks, will be showing advanced solutions supporting the latest 5G standards and network deployments at Mobile World Congress (MWC) 2022 at Barcelona.
Colleen Harper announced as IES's Executive Director
The Illuminating Engineering Society (IES) is excited to announce Colleen Harper, MPA, CAE as its new Executive Director, effective March 14, 2022.
Indium corporation to present on e-mobility at SMTA Michigan
Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving EV landscape at the SMTA Michigan Expo & Tech Forum at 9am local time, May 17, US.
Why should you use air-gaps in Rigid-Flex PCBs?
The innovative design configurations of Rigid-Flex PCBs are enabling high-level design integration and package density.The innovative design configurations of Rigid-Flex PCBs are enabling high-level design integration and package density.
ESCATEC names new CEO to accelerate the Group’s expansion
Integrated electronics manufacturing services (EMS) provider, ESCATEC, has appointed industry veteran Ernest Sebak as its new Chief Executive Officer (CEO) with the mandate to deliver the Group’s ambitious growth plans and further enhance its reputation as a highly customer centric and trustworthy organisation.
New process technology for high-tech adhesives
With activation on the flow, DELO has developed an innovative process technology combining adhesive dispensing and preactivation in a single process step for the first time.