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The Small Tech. Research Group has announced the new EST Series of isolated DC-DC converters to their growing portfolio of isolated DC-DC converters for high-speed networking, telecommunications, and computing applications. The 1/16 brick (1.3”x 0.9” footprint) parts are capable of delivering up to 50W of output power at higher voltages, or up to 20A of output current at an output of 1.8VDC. The low-cost devices are designed to operate effic...

ProVision Communications today announced David Newland has joined the company as chief financial officer (CFO). David, a former Vodafone Group Financial Controller and Managing Director for its UK Paging division, has over 20 years of experience as a Financial Director of mobile telephony and wireless networks. David spent 16 years at Vodafone, since then he has been providing consultancy services to the telecom sector.

XMOS has released a new package option for the G4 programmable device, the first member of the XS1-G4 family. The new 144-pin BGA package option is designed for systems that require the smaller form factor (11mm square). With a .8mm ball pitch it is ideal for compact designs and simple PCB layout. For designs that require a full complement of 256 I/O pins a 512-pin BGA package is available.

element14, a collaborative social community and electronics store for design engineers and electronics enthusiasts, today announced the addition of Jeremy Blum to its “Ask an Expert” panel, giving professionals, enthusiasts and DIY-ers alike a valuable resource for Arduino programming questions and topics.

Advanced Thermal Solutions introduced a line of lower height maxiFLOW heat sinks for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks feature a spread fin array that maximizes surface area for more effective convection (air) cooling. Standard sink heights are as low as 9.5 mm.

Advanced Thermal Solutions has announced the introduction of superGRIP, a new two-component, attachment system which quickly and securely mounts heat sinks to a wide range of hot running Ball Grid Array (BGA) components, while using a minimal amount of space on the PCB and eliminating the need to drill holes.

NEC Electronics today introduced a new application-specific standard product (ASSP) based on the company's unique single-frame super-resolution technology which reduces the blurring that occurs when low-resolution images are expanded and displayed in high-resolution. The ASSP sharpens out-of-focus images, smoothes rough edges and refines contours by analyzing and processing information contained in one frame of data in real time. Using standard v...

NEC Electronics Europe announced the release of the 78K0R/Lx3 — SENSE IT! development kit. SENSE IT! is a single-board, LCD control development platform designed specifically for the evaluation of NEC Electronics’ 16-bit 78K0R/Lx3 microcontroller. It includes an on-chip liquid crystal display (LCD) driver circuit, optimized especially for the fields of handheld healthcare diagnostic instruments such as blood glucose meter, building utility me...

NEC LCD Technologies has introduced a new 9.0-inch (23 centimeters diagonal) amorphous-silicon thin-film-transistor (TFT) liquid crystal display (LCD) module, part number NL8048BC24-04, with wide video graphics array (WVGA) resolution for industrial equipment, including factory automation and measurement equipment. The new module incorporates NEC LCD Technologies' proprietary ultra-advanced, super-fine TFT (UA-SFT) technology that enables superio...

NEC LCD Technologies has introduced two new amorphous-silicon thin-film-transistor (TFT) liquid crystal display (LCD) modules incorporating white LED backlights for industrial applications. The modules consume less power, are substantially thinner and lighter than comparable LCD modules incorporating cold-cathode fluorescent lamp (CCFL) backlights.