Search results for "geometry"

Littelfuse has introduced the SR05 Series TVS Diode Array – SPA Diodes, designed to protect telecommunication and industrial equipment against electrostatic discharge and lightning-induced surge events.

Aptifirst’s SWOPP range of sapphire window optical process probes is ideal for laboratory, pilot plant and inline monitoring and for quality and process control. SWOPP probes, using the 0.17-5.5-micron optical transmission range of sapphire, can work in the near-infrared, visible and ultraviolet parts of the spectrum, permitting various spectrometric techniques to be employed.

More than one quarter of installed wafer capacity worldwide is dedicated to producing IC devices using process geometries (or feature sizes) smaller than 40nm, according to data in IC Insights’ Global Wafer Capacity 2013—A Detailed Analysis and Forecast of the IC Industry’s Wafer Fab Capacity.

Optenni announces a new version of the Optenni Lab matching circuit optimization and antenna analysis software featuring a unique easy-to-use simultaneous multiport matching capability for antennas and other RF applications. The work of an antenna engineer is becoming increasingly complex due to the growing number of radio systems, frequency bands and antennas.

HARTING has introduced a version of its established Han HC Modular 650 high-current connector contacts with crimp termination. The new contacts are plug-compatible with existing variants with axial screw termination, and create greater design flexibility for customer applications. The contacts are fixed in a plastic insert, which creates a single-pole high-current contact.

Radan has launched the first of a series of logistics products to complement its market-leading sheet metal CAD/CAM software. Radimport automates a further part of the manufacturing process, saving time and adding to the user’s bottom line. One early Radimport user – a lift manufacturer – has cut its processing time by half; from five days to two-and-a-half days for each lift it makes.

Sancvik Coromant announces the exhibition debut at JEC Europe 2013 (Paris, 12-14 March) of its new CoroMill Plura compression end mill composites is likely to be of great interest to any manufacturer machining CFRP.

Molex Incorporated has introduced the next-generation HSAutoLink II interconnect system for linking multiple high-speed media protocols in automotive electronics. The HSAutoLink II system is designed for in-vehicle infotainment, telematic devices, radio and navigation systems, in addition to intelligent assistant systems and cameras for parking, lane departure, pedestrian warning, night vision, and other collision avoidance vision systems.

Altair today announced the release of HyperWorks 12.0, the most comprehensive computer-aided engineering platform in the PLM market. HyperWorks 12.0 offers new functionalities and end-user productivity advancements in product optimization, finite element modeling, multiphysics analysis, powertrain durability analysis, lightweight design and many others.

Dassault Systèmes today announced the general availability of the latest release of its Version 5 PLM applications. Today’s V5-6R2013 release adds new composite fibre modeling technology (based on the recently acquired Simulayt), increased openness and standards support and enhanced high-end surface modeling capabilities.