Search results for "tvs array"
Samsung Selects Broadcom's Integrated Dual-Band 802.11n Wi-Fi Solution
Broadcom Corporation announced that Samsung Electronics Co., Ltd. has selected its integrated dual-band 802.11n Wi-Fi® system-on-a-chip (SoC) solution to power its line-up of connected Blu-ray Disc players. Samsung had already selected Broadcom's leading-edge Blu-ray SoC solution to deliver the outstanding quality audio/video and BD-Java performance for which Broadcom is recognized.
Broadcom Expands Bandwidth for 4G Mobile Backhaul with Latest High Performance Switching Silicon
Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced its latest StrataXGS® BCM56440 switch series, developed specifically to address the economic and performance challenges of service providers as they upgrade legacy mobile networks to manage the exponential growth in wireless data traffic and transition to 4G.
Broadcom - 40nm HD Full-Resolution 3DTV Video Gateway STB SoC Solution
Broadcom Corporation announced and is sampling a new ultra-high performance dual high definition (HD) set-top box (STB) system-on-a-chip (SoC) video gateway solution with more than two times the performance over previous generations. Designed in 40nm CMOS silicon technology, the BCM7422 achieves breakthrough levels of performance and integration, reducing power consumption and lowering overall costs to meet the need for the next generation connec...
Sital Announces the Availability of Mil-Std-1553 Component
Sital Technology, the world leader in Mil-Std-1553 IP cores and products, announces the availability of the world’s smallest Mil-Std-1553 bus controller component– Minuet. Minuet is a family of compact, standalone, Mil-Std-1553B protocol terminals, which includes Bus Controller (BC), Remote Terminal (RT) and Monitor (MT).
Sofradir gives five talks on new trends in infrared detectors at SPIE Defense and Security Symposium 2011
Sofradir, a leading developer and manufacturer of advanced infrared detectors for military, space and commercial applications, today announced that company executives will give five presentations on new trends in infrared (IR) detectors for military and space applications at the SPIE 2011 Defense and Security Symposium, April 25 – 29, in Orlando, Fl.
Sofradir shows the future in infrared detection for military and space applications at SPIE DSS 2012
Sofradir announces today that it will demonstrate a prototype of the first 10-micron pixel pitch infrared (IR) detector for tactical applications at SPIE DSS in Baltimore, April 23 – 27.
AMETEK Announces 2012 Release of Fully Automated EN50530 Test System Leveraging the “Surround the Inverter” Concept,
AMETEK Programmable Power announces a fully automated EN50530 test solution that utilizes three core “Surround the Inverter” elements: the AMETEK TerraSAS Solar Array Simulator, MX/RS Grid-Simulator and CTS Compliance Test System.
Juki to Showcase Its Latest Automated Assembly Solutions at IPC APEX EXPO
Juki Corporation, a world-leading provider of automated assembly products and systems, will showcase its latest assembly systems in Booth #1559 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Rutronik - Vishay’s new IHLP inductor
The new IHLP® low-profile, high-current inductor in the 6767 case features an ultra-low 4.0mm profile. The IHLP-6767DZ-11 offers high efficiency with maximum DCR down to 2.05m Ohms and a wide range of standard inductance values from 1.0µH through 47.0µH. Samples and production quantities of the new inductor are available now at distributor Rutronik.
First Telit HSPA-BGA module available at Rutronik now
To future-proof data transmission devices against non-availability of the 2G network, Telit is launching the HE series. The Telit HE863, the first module in the new series, is a powerful, low-cost and fully equipped HSPA M2M module with embedded GPS receiver and 22 GPIOs (General Purpose Input/Outputs) in a ball grid array (BGA) form factor.