Search results for "SiC MOSFET"

There was a palpable “Good to see you again!” vibe in the halls of Nuremberg Messe as PCIM Europe took place. GaN and SiC technology dominated but other developments for automotive and industrial applications were also talking points, writes Caroline Hayes

The long-standing partner, Diotec Semiconductor, honors the achievements of Rutronik Elektronische Bauelemente GmbH and awards the distributor with the "Top Sales Partner Award 2022".

Welcome to the Shortlist Announcement page! Here you will find the amazing, shortlisted products for the most rigorous and transparent award in the industry. The Electronics Excellence Award ceremony will be taking place at the Electronic Specifier Booth on the first day of electronica on 15th November at 12:00pm. You are all welcome to come and visit Booth no. B4-451 to see which product will win! Comment below which product you think will wi...

SICK has unveiled its next-generation family of large-bore hollow-shaft incremental encoders, the SICK DGS80.

Two decades ago, Nexperia transformed the semiconductor industry with a unique clip-bond package for power MOSFETs. This disruptive innovation was called LFPAK, offering the lowest power losses of any package on the market. It was revolutionary, offering radical performance improvements that gave early adopters extraordinary improvements in performance, efficiency and size. Backed by 20 years’ continuous innovation, the story continues.

For any portable device, other motion sensors may tell you where you are and how fast you’re moving, but to find out which direction you’re pointing you need a reliable magnetometer.

SiC is maturing fast. The supply chain for SiC is still developing, but some manufacturers are ahead of the curve. onsemi and Avnet Silica have teamed up to bring you the resources you need to increase your SiC understanding, all in one place. Benefit today from the advance knowledge about power switching technologies.

Vishay Intertechnology has introduced a 4th-gen 600V EF Series fast body diode MOSFET in the low profile PowerPAK 10 x 12 package.

STMicroelectronics will build an integrated SiC (silicon carbide) substrate manufacturing facility in Italy to support the increasing demand from ST’s customers for SiC devices across automotive and industrial applications as they transition to electrification and seek higher efficiency.

The OMRON G3VM-AY & DY are small size high dielectric strength type MOSFET relays. Featuring dielectric strength of 5,000VAC between input and output in a small DIP4 package, these relays are available with various load voltages, and the range includes high sensitivity types.