Search results for "Indium Corporation"
Indium corporation to present on e-mobility at SMTA Michigan
Indium Corporation’s Brian O’Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving EV landscape at the SMTA Michigan Expo & Tech Forum at 9am local time, May 17, US.
Joint process development presentation at SMTconnect
Indium Corporation expert Andreas Karch, Regional Technical Manager and Technologist – advanced applications, and Ralf Sedlatschek, Head of Technology, KATEK Group, will co-present their joint process development on a materials solution to prevent hotspots in thermally-critical components at SMTconnect, May 10, 11:40 a.m.-Noon, Nuremberg, Germany.
Manufacturers are more concerned about outdated EV batteries
Electric mobility is undoubtedly acquiring momentum with each passing year. Widely hailed for their potential to reduce global carbon footprints, manufacturers are devising new technologies which will further boost sales.
Opening up new possibilities in medical 3D imaging
Medical imaging technology has advanced tremendously since Roentgen discovered X-rays at the end of the 1800s.
Renesas announces its first Wi-Fi development kit
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced its first development kit that includes support for the new Matter protocol.
Greene Tweed appoints Magen Buterbaugh President and CEO
Greene Tweed announces the appointment of Magen Buterbaugh as President and CEO of Greene Tweed effective January 3, 2023.
AirFuel Alliance announces global at-a-distance RF wireless charging standard
AirFuel Alliance, the authority on next-gen wireless power technology and standards, announces the release of a global interoperable standard for RF wireless power transfer.
Signal quality analyser-R MP1900A supports PCI Express 6.0 base specification Rx test
Anritsu Corporation (President Hirokazu Hamada) has announced that its Signal Quality Analyser-R MP1900A now supports the PCI Express 6.0 (PCIe 6.0) Base Specification Receiver Test (Rx Test).
CES 2023: RFCMOS single chip adds 4D sensing for ADAS
NXP Semiconductors has unveiled the first 28nm RFCMOS single chip at the Consumer Electronics Show in Las Vegas (January 5-8).
30 to 75W DC-DC converters for industrial and rail applications
TDK Corporation announces the introduction of the 30-75W TDK-Lambda brand PYQ series of DC DC converters. The PYQ50 with 30-50W output power features a 12:1 ultra-wide input range of 14 to 160Vdc, and the PYQ75 with 75W an 8:1 input of 9 to 75Vdc.