Search results for "skills gap"
STI Electronics requalifies for four IPC Qualified Manufacturers listings
STI Electronics, a full-service organisation providing training services, training materials, analytical/failure analysis, prototyping, and electronic contract manufacturing, proudly announces its requalification for four prestigious IPC Qualified Manufacturers Listings (QML) including IPC-A-610, J-STD-001, J-STD-001 Space, and IPC-1791, Class 3.
Arrow's reference design for EV charger development
Arrow Electronics has introduced a data-communication reference design tailored for electric vehicle (EV) charging systems, incorporating advanced software protocols and a HomePlug Green PHY hardware module.
5 key uses for virtual and augmented reality in electronics manufacturing
In the rapidly evolving world of electronics, staying ahead of the curve is imperative. That’s why many electronics and original equipment manufacturers (OEMs) are investing more in new technologies, particularly invirtual reality (VR) and augmented reality (AR).
Advanced Energy's new impedance matching network
Advanced Energy Industries has introduced the NavX impedance matching network.
Sener delivers first units for Lilium Jet
Sener has completed the delivery of the initial units intended for certification testing and is on track to supply the first 100 flight servo-actuators within this year.
Molex report looks at connector design trends
Molex has published a report detailing the significant role of ruggedised, miniaturised interconnect solutions in driving innovation in electronic devices across an expanding array of industries.
Avnet appoints Rebeca Obregon Farnell President
Avnet has announced that Rebeca Obregon will assume the role of President at Farnell, an Avnet company, starting 1 July 2024.
TiniFiber releases arc fusion splicers
TiniFiber has collaborated with FiberFox America Inc. to launch two new arc fusion splicer systems.
Electric HGVs put to the test in eFREIGHT trial
The recently initiated eFREIGHT 2030 trial is set to rigorously test electric heavy goods vehicles (HGVs) and establish their viability within logistics fleets over the coming decade, according to Dynamon, the project's planning software provider.
Siemens and Intel's partnership bears fruits
Siemens Digital Industries Software announced that its continued partnership with Intel Foundry has led to the creation of a new Electronic Design Automation (EDA) product certification and anadvance in embedded multi-die interconnect bridge (EMIB) technology.