Search results for "graphics"
Hammond 1597DIN UL94-V0 DIN rail enclosures
Hammond Electronics has announced its family of 1597DIN UL94-V0 flame-retardant plastic enclosures for mounting to standard IEC/EN 60715 35mm DIN rails for applications such as industrial control equipment, automation, equipment management and monitoring, HVAC controllers and distributed IoT equipment.
Neural network IP for FPGA smart embedded vision
It has been announced that through its Smart Embedded Vision initiative, Microchip Technology is meeting the growing need for power-efficient inferencing in edge applications by making it easier for software developers to implement their algorithms in PolarFire field-programmable gate arrays (FPGAs). One way the company is achieving this is via a Neural network IP for FPGAs.
Single Board Computer module suits SWaP applications
An Intel-based 3U OpenVPX single board computer (SBC) module designed for reduced Size, Weight and Power (SWaP) requirements has been introduced by Sundance Multiprocessor Technology.
A smart initiative seeks to decentralise power
The demand for modular power systems is transforming manufacturing, resulting in decentralisation of system components argues Maximilian Hülsebusch, PULS Power
Green Hills Software supports NXP i.MX 8 processors
Green Hills Software has announced that its INTEGRITY-178 Time-Variant Unified Multi-Processing (tuMP) RTOS now supports heterogeneous multicore operation on NXP Semiconductor’s i.MX 8 processors across Arm Cortex-A72 and Cortex-A53 cores for airborne safety-critical and security-critical systems.
Dimensity 820 chip brings 5G experiences to smartphones
MediaTek has announced the Dimensity 820 system-on-chip (SoC) which is optimised for premium user experiences. The Dimensity 820 delivers ultra-fast 5G speeds, and is feature-packed with MediaTek's latest multimedia, AI and imaging innovations.
Pushing the envelope for ADAS with advanced memory technologies
Driver assistance systems such as cruise control are now part of the standard specification in a modern vehicle. ADAS Level-2 (L2), partial automation, and the first Level-3 (L3) conditional automation systems are in the market, but the journey to full automation still has some years to go. Here, Frank Ferro, Senior Director of Product Marketing for IP cores at Rambus explains.
European electronic components market trends Q1 2020
The European electronic components Distributor Total Available Market (DTAM) emerged from a technical recession and returned to growth in the first quarter of 2020, reported Adam Fletcher, Chairman of the International Distributors of Electronics Association (IDEA).
SMARC 2.1 modules designed for high volume projects
The new, cost-effective MSC SM2S-IMX8NANO family of modules based on i.MX 8M Nano processors from NXP is the latest addition to Avnet Integrated’s portfolio.
C878 Xeon D-based SBC alleviates processing bottlenecks
Aitech has released its latest security-enabled SBC alleviates bottlenecks and features up to 16 lanes of PCIe to handle increased data processing requirements, while protecting the board from data attacks and cyber threats. The new C878 is a 3U VPX board that provides Intel Xeon D level processing in a rugged, industry-standard form factor.