Search results for "advanced engineering"

Industrias Alegre has signed a collaboration agreement with TactoTek.The collaboration will involve the development of innovative human-machine interface (HMI) solutions that can be integrated into applications for different markets, especially automotive.

IBM has opened its first quantum computing center outside the US at Ehningen in Germany. It marks a significant expansion of the company’s fleet of advanced, utility-scale quantum systems available to global users via the cloud.

Infineon has announced the addition of the EZ-USB FX20 programmable USB peripheral controller to its EZ-USB product family.

Engineering business leader Warren East CBE has been appointed as the 143rd President of the Institution of Engineering and Technology (IET).

EUK Education – a new brand fromEngineeringUK– has launched tooffer the teaching and careers community support and resources to inspire more young people to get intoSTEMand the many diverse career paths available.

Pickering Interfaceswill showcase its range of industry-standard modular PXI/PXIe and LXI signal switching and simulation products for electronic test and verification – including a turnkey LXI microwave switching matrix demo – on stand J1 at Engineering Design Show (EDS) 2024, at Coventry Building Society Arena from 9–10 October 2024.

With the mining industry at a pivotal point, facing unique issues that demand advanced technology solutions to enhance safety and operational efficiency, technology development specialist Plextek has released advice that will help the sector to meet these new challenges.

Saelig has announced the Pico Technology PS3417E MSO and PS3418E MSO, USB-powered 5GSa/s PC-based oscilloscopes with MSO mixed-signal capabilities.

Saelig has announced the Siglent SDS7000A series of high-bandwidth, high-resolution oscilloscopes with advanced features such as 20GSa/s sampling, 12-bit vertical resolution, and 500 Mpts per channel memory.

Alphawave Semihas announced the availability of the industry's first 3nm silicon-proven Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) IP subsystem.