Search results for "NTT Corporation"

Tektronix has promoted Christopher Bohn to President of the global test and measurement company.

Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the US government and European Commission are gathering in Washington, D.C. this week to discuss ‘the next big thing’ in CHIPS Act implementation: expanding ‘advanced packaging’ capacities and capabilities to go along with expanding production of semiconductor chips.

As part of its electric vehicle (EV) focused series of webinars, Driving e-Mobility: Rel-ion Technical Webinars, Indium Corporation’s David Sbiroli, principal engineer, will share how to optimize two of the most important areas of the SMT assembly process—printing and reflow.

Electric mobility is undoubtedly acquiring momentum with each passing year. Widely hailed for their potential to reduce global carbon footprints, manufacturers are devising new technologies which will further boost sales.

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, announced its first development kit that includes support for the new Matter protocol.

Greene Tweed announces the appointment of Magen Buterbaugh as President and CEO of Greene Tweed effective January 3, 2023.

AirFuel Alliance, the authority on next-gen wireless power technology and standards, announces the release of a global interoperable standard for RF wireless power transfer.

Medical imaging technology has advanced tremendously since Roentgen discovered X-rays at the end of the 1800s.

NXP Semiconductors has unveiled the first 28nm RFCMOS single chip at the Consumer Electronics Show in Las Vegas (January 5-8).

Anritsu Corporation (President Hirokazu Hamada) has announced that its Signal Quality Analyser-R MP1900A now supports the PCI Express 6.0 (PCIe 6.0) Base Specification Receiver Test (Rx Test).