Search results for "HyRel Technologies"

Alphawave Semi has expanded its strategic partnership with Samsung Foundry. The expanded agreement encompasses leading-edge IP for PCI Express 7.0, 112G and 224G Ethernet and the latest UCIe (Universal Chiplet Interconnect Express) die-to-die interconnect standard that is enabling next-generation SoC (system-on-chip) technologies for AI and other HPC systems.

New families of silicon carbide (SiC) MOSFETs and Schottky Barrier Diodes (SBDs) in TSPAK packaging are being premiered by WeEn Semiconductors at PCIM Europe in Nuremberg (June 11-13).

Element Six (E6) and Orbray announced a strategic collaboration to deliver the world’s highest quality wafer-scale single crystal (SC) synthetic diamond.

SemiQ has added 1700V SiC Schottky discrete diodes and dual diode packs to its QSiC product line.

Pixus Technologies, a provider of embedded computing and enclosure solutions, has introduced their most compact test and development chassis, named the Mini Cube.

At PCIM 2024, ROHM unveiled its new SiC product offerings as well as outlined its vision for the future. Leading the conversation was Dr. Kazuhide Ino, Managing Executive Officer & Head of Power Device Business at ROHM.

At the Digital Enterprise Show (DES) in Malaga, industry leaders gathered to discuss the future of immersive technologies, exploring how virtual reality (VR), augmented reality (AR), spatial computing, digital twins, haptic feedback systems, artificial intelligence (AI), and blockchain integration are ready and waiting to shake-up the tech landscape.

Infineon Technologies introduces Power System Reliability Modelling, a solution designed to address the increasing challenges faced by data centres and telecom infrastructures due to power supply failures.

ROHM has announced the launch of its new EcoSiC brand. EcoSiC is a trademark for ROHM products using the advanced material silicon carbide (SiC).

Viavi Solutions Inc. announces its participation in the IEEE International Communications Conference in Denver, Colorado, where it will present research, solutions, and perspectives on next-generation networking technologies, including 6G, AI, Open RAN (O-RAN), and Non-Terrestrial Networks (NTNs).