Search results for "rf fixed attenuators"

STMicroelectronics is making embedded artificial intelligence truly here-to-help with a new microcontroller series integrating, for the first time, accelerated machine-learning (ML) capabilities.

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the first product of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation wireless solutions for industrial and consumer IoT applications.

The new R&S NRPxE power sensors from Rohde&Schwarz feature a dynamic range of 80 dB, a video bandwidth of 100 kHz, and the ability to perform up to 1,000 measurements per second.

STMicroelectronics has introduced a new microcontroller (MCU) series that, for the first time, acelerated machine learning (ML) capabilities.

Amazon’s Sidewalk provides developers working on devices for the Internet of Things (IoT) with a powerful combination of features and services. The ability to pick between three different wireless protocols to link devices to reliable and smart Cloud services enables many novel applications. To make the most of the options available, a deeper analysis is needed of how these different wireless protocols work and how they can be used for a pa...

Keysight Technologies and the UK’s National Physical Laboratory (NPL) have collaborated on a groundbreaking research project, exploring RF power at cryogenic temperatures.

Mouser Electronics has published a new eBook in collaboration with Cinch Connectivity Solutions.

Advantest Corporation will showcase its latest test solutions atSEMICONJapan 2024 on Dec. 11-13 at the Tokyo Big Sight in Tokyo, Japan.

Ultrasonic DIE bonding is a fast, clean, and efficient technology increasingly utilised in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This method leverages high-frequency ultrasonic vibrations to create a reliable bonds between semiconductor DIEs and substrates, significantly reducing thermal stress. The advantages of ultrasonic DIE bonding include rapid processing times, low temperatures, and excel...

Applications that quickly and accurately locate people and items drive significant growth in positioning technologies. A 2024 Gartner report projects the indoor location services market will reach $55 billion by 2030, up from $1.9 billion in 2021.