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Yole analyses NXP’s, Qorvo’s, and Apple’s WBG approaches
Yole Group has provided a comprehensive review of UWB technologies, highlighting and comparing the solutions implemented in smartphones by leading companies, Apple (with their internal U2 module), Samsung (with SR200 solution from NXP), and Google (with DW35725 solution from Qorvo).
Leading innovators vie for UK’s top engineering award
AI-powered weather forecasting, innovative heat batteries using phase-changing materials, and the rapid manufacturing scale-up of a COVID-19 vaccine are competing for a prize for engineering innovation.
Understanding the future of embedded AI networks
Consider face-ID, which allows access to machine controls on a factory floor. It is obvious why using AI in embedded applications is appealing.
Cervoz unveils U.3 enterprise SSD
Cervoz has unveiled its new U.3 enterprise SSD for big data applications and modern enterprise.
Acer's showcases its latest products at Computex 2024
Acer made several exciting announcements at Computex 2024, showcasing their latest advancements in technology across various product categories.
ByteSnap releases AI in electronics survey findings
ByteSnap Design has released the findings of its survey on the impact and perceptions of AI within the electronics industry: entitled AI in Electronics: Balancing Promise and Pragmatism.
IDEE analyses MFA cyber security in businesses
Less than half of businesses using 1st generation Multi-Factor Authentication (MFA) do so because they believe it to be the most secure option available, new research from IDEE has revealed.
The over-hype of generative AI vs actual use: a study
A recent online survey conducted across six countries—Argentina, Denmark, France, Japan, the UK, and the USA—sought to understand the public’s awareness, usage, and opinions on generative AI. The findings reveal a stark contrast between the hype surrounding AI and its actual adoption and utilisation in daily life and specific sectors, including journalism.
Tech companies agree safety commitments on development of AI
New commitments to develop AI safely have been agreed with 16 AI tech companies spanning the globe, including companies from the US, China, and the Middle East, marking a world-first on the opening day of the AI Seoul Summit.
MediaTek unveils the Dimensity 9300+ SoC
MediaTek has unveiled the Dimensity 9300+, the latest flagship mobile chip in MediaTek’s Dimensity portfolio.