Search results for "electronic propulsion"
RTI Connext Drive chosen for vehicle communications
Real Time Innovations (RTI) recently announced that XPENG has chosen RTI Connext Drive to provide core communication technology for its E/E vehicle architecture.
Indium to show gold solder solutions at MD&M West
Indium will feature its high-reliability AuLTRA MediPro gold solder solutions at MD&M West, running 4-6 February in Anaheim, California.
3D printing geopolymers from Lunar Soils – GLAMS Project
Funded by ASI – the Italian Space Agency, the two-year GLAMS Project (Geopolymers for Additive Manufacturing and Lunar Monitoring) aims to create structural elements for the construction of lunar bases through a 3D printing approach that uses cement binders extracted from lunar soils (regolith).
Aven launches latest tweezers line
Aven is pleased to announce the launch of its EZ Grip Tweezers line, high-performance tools designed for precision, durability and comfort, to meet the demands of electronic assembly, repair and laboratory applications.
Honeywell and NXP expand partnership for aviation tech
Honeywell and NXP Semiconductors have announced at CES 2025 an expanded partnership that will accelerate aviation product development and chart the path for autonomous flight.
element14 to host two upcoming webinars
element14 has annonced two upcoming webinars this January 2025, designed to empower engineers and professionals which will share insights into cutting-edge technologies such as DC-DC converters and MEMS sensors.
Hong Kong’s innovations radiating impact at CES 2025
Hong Kong Science and Technology Parks Corporation (HKSTP) marked significant presence at the Consumer Electronics Show (CES) 2025 in Las Vegas, where a largest-ever delegation of 51 tech companies and institute at Hong Kong Tech Pavilions is capturing the attention of industry leaders, corporate partners and venture capitalists from global markets for business leads and investment opportunities.
Bosch IMUs enable gesture control in wearables
Designing wearable devices presents significant challenges, particularly in achieving a compact form factor while ensuring ease of use and intuitive interfaces. Devices like AR/VR headsets, smart glasses, and AI pins are revolutionising user interactions through gestures such as air pinches and finger drags.
SYSGO introduces TPM support in embedded systems
SYSGO has announced the availability of Trusted Platform Module (TPM) support in the embedded Linux development platform ELinOS, marking a significant step in embedded security.
Quantum Science signs JDA with European sensor company
Quantum Science has announced that it has signed a joint development agreement with a European sensor company to integrate its quantum dot (QD) ink products into high-tech imaging systems.