Search results for "advanced engineering"
ByteSnap Design announces strategic partnership with Particle
ByteSnap Design has announced a strategic partnership with Particle to accelerate IoT innovations.
Professor Brian Cox excites 400 curious minds at STEM event
Brooklands Innovation Academy(BIA) 2024 marked a significant milestone as it held its largest and most impactful event yet, gathering 400 students aged 11 to 18 for a full day of immersive STEM education.
SECO to highlight Qualcomm’s advanced computing solutions
SECO, a global provider of end-to-end solutions for embedded computing, announces its participation in the inauguralembedded world North Americain Austin, Texas, from 8–10 October 2024.
Gluespec announce new engineering resources
Gluespec has announced new resources for engineers looking for advanced materials.
Boosting solar cell efficiency and durability
Researchers at the Hong Kong University of Science and Technology (HKUST) have made significant strides in the development of perovskite solar cells, enhancing both their efficiency and durability through a novel molecular treatment.
Moldova wins at 2024 FIRST Global Challenge Robotics Olympiad
The Republic of Moldova has once again demonstrated itsexcellence in robotics, securing two gold medals at the FIRST Global Challenge 2024, the world’s largest high school robotics competition.
TE Connectivity to showcase e-mobility solutions
In the fast-paced automotive industry, the power of connections is more critical than ever. Engineers and OEMs are under constant pressure to enhance the driving experience, while adapting designs to changing vehicle architectures and platforms and addressing consumer demand for safer, more advanced vehicles.
Proprietary technique produces ultra smooth laser mirrors
Optical Surfaces Ltd. has developed an advanced pitch-polishing technique that consistently produces ultra-smooth off-axis parabolic (OAP) mirrors, a crucial element for high-power laser experiments. This proprietary method achieves surface microroughness of less than 1nm RMS, significantly improving focusing performance by reducing the scattering effects that can arise from surface texture irregularities.
Synopsys and TSMC Pave the path for trillion-transistor AI and multi-die chip design
Synopsysannounces its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs.
SECO at embedded world North America 2024
SECO has announced its participation in the inauguralembedded world North America, taking place in Austin, Texas, from 8-10thOctober 2024.