Search results for "OEM"
Farnell unveils Design, Build, Maintain HUB
Farnell has launched its new Design, Build, Maintain HUBto support how developers, OEMs and industrial customers navigate every stage of the product lifecycle, from conception to maintenance.
Emerson’s new compact, rugged PC built to connect industrial floor to Cloud
Emerson has announced the new PACSystems IPC 2010 Compact Industrial PC (IPC), a rugged industrial computer designed to handle a wide range of machine and discrete part manufacturing automation applications.
What are the key camera features of warehouse automation drones?
Warehouse automation drones require advanced camera vision sensors and technologies to ensure efficient performance.
Tackling energy vampires in our homes
As a confluence of factors – from post-COVID and post-Brexit supply chain challenges, to the Russia-Ukraine war – continue to fuel a global cost-of-living crisis, consumers concerned about rising energy prices are looking for measures that can help reduce their monthly bills. In this article, Darrel Kingham, CEO, Pulsiv explains how to tackle wasted energy from ‘vampire devices’ in the home.
Scaling up SiC crystal growth to meet demand
Due to the complexity of growing quality silicon carbide (SiC) crystals, manufacturers need help obtaining sufficient systems to meet global production targets
Software-Defined Vehicles – engineering the vehicles of tomorrow
Software-Defined Vehicles (SDVs) are set to ‘radically transform’ the automotive industry for the better, says Contechs, an automotive design and engineering company.
How to choose the right hardware for compliance with new IoT cybersecurity regulations
OEMs everywhere must deal with a wave ofnew cybersecurity legislationapproaching fast, including the UK’s Product and Security Telecommunications Infrastructure (PSTI) law coming into effect in 2024, and the European Union’s CE RED (Radio Equipment Directive) 2014/53/EU certification for wireless devices (August 2025). Implementing security protection features in new embedded product designs is now a task that no OEM can postpone.
Successful demonstrate Open vRAN and 5G Core UPF using Arm-based CPUs
NEC Corporation together with Arm, Qualcomm Technologies, Red Hat, and Hewlett Packard Enterprise (HPE) have successfully demonstrated end-to-end operation of NEC's Open virtual Radio Access Network (vRAN) and 5G Core virtual User Plane Function (vUPF) products using the HPE ProLiant servers running Arm Neoverse-based CPUs and the Qualcomm X100 5G RAN Accelerator Card, with Red Hat OpenShift in conditions equivalent to a commercial environment.
Pico unveils the PicoScope 6428E-D
Pico Technology, a provider of test and measurement equipment, introduces the PicoScope 6428E-D oscilloscope, a device designed for applications demanding superior performance in signal analysis.
Newly integrated IIoT capabilities create added value
Congatec is set to unveil a series of new IIoT Computer-on-Modules at embedded world (Hall 3, Booth 241).