Search results for "HyRel Technologies"
OutSystems and KPMG survey explores AI and the future of software development
As the reach of artificial intelligence (AI) expands, IT leaders are exploring new use cases for technology used throughout the software development lifecycle (SDLC), according to a new survey titled ‘AI in software development: Exploring opportunities and uncertainties’ by OutSystems, a global pioneer transforming how companies innovate through software, and KPMG, a multinational professional services network.
Saelig introduces new Amplicon Impact-Pi 100D industrial PC
Saelig has announced its new Amplicon Impact-Pi 100D series of industrial embedded computers.
Honda begins collaborative AI project with India
Honda has announced its collaboration with two Indian Institutes of Technology (IITs) – IIT Delhi and IIT Bombay – to advance research in artificial intelligence (AI) with the aim of enhancing its Cooperative Intelligence (CI) systems. Honda's CI is an original AI technology designed to foster mutual understanding between humans and machines.
Memfault joins STMicroelectronics Partner Programme
Memfault,provider of the embedded device observability and over-the-air (OTA) platform, has announced that it has joined the ST Partner Programme, allowingSTMicroelectronics’ customers that develop embedded IoT devices to gain visibility into device performance and reliability, proactively identify issues, and quickly push targeted fixes out to devices.
Advantest lines up test solutions for SEMICON India
Semiconductor test equipment supplier Advantest will feature its leading-edge IC test solutions at the first-ever SEMICON India at the India Export Mart (IEML) in Greater Noida (Sept. 11-13).
Nidec Group companies to exhibit at IMTS 2024
Nidec announces that Nidec Group companies of Nidec Machine Tool Corporation, Nidec OKK, Takisawa Machine Tool, and PAMA, will exhibit their products at IMTS 2024, the largest manufacturing technology exhibition in the US, to be held in the city of Chicago, Illinois, from 9–14 September 2024.
Ultra-thin material set to boost satellite comms for 6G
A recent study by theUniversity of Glasgowhas introduced an ultra-thin material, called a "metasurface," designed to improve how satellites send and receive signals, particularly in the Ku, K, and Kafrequency bands.
Sondrel announces advanced modelling process for AI chip designs
Sondrel has announced an Advanced Modelling Process for AI chip designs. This runs through every stage of a chip’s design to ‘prove’ that the design is what was specified – Functional Verification -- and that it does what it is supposed do – Performance Verification.
TUAL announces swappable PowerBank solution for eHGVs
TUAL has announced its highly flexible PowerBank Pro-Charging offering for electric Heavy Goods Vehicles (eHGVs).
The time for autonomy in mobile machines is now
“Why Autonomy, Why Now?” Jahmy Hindman, Senior Vice President and Chief Technology Officer, Engineering and Technology, John Deere, will discuss current technology trends at the International VDI Congress ELIV 2024 and the parallel conferenceElectrics/Electronicsfor Mobile Machines.