Search results for "CU Phosco"
OptiMOS Linear FET 2 MOSFET enables optimal hot-swap and battery protection
The safe hot-swap operation in AI servers and telecom requires MOSFETs with a robust linear operating mode as well as a low RDS(on). Infineon Technologiesaddresses this challenge with the new OptiMOS 5 Linear FET 2, a MOSFET designed to provide the ideal trade-off between the RDS(on)of a trench MOSFET and the wide safe operating area (SOA) of a classic planar MOSFET.
Junkosha connector design improves cable performance
Global interconnect pioneers Junkosha announces the launch of its ownbranded connectors,which will be integrated into Junkosha Microwave/mmWave Coaxial Cable Assemblies from February 2025.
Hexagon and Fraunhofer electrochemical simulation solution
Hexagon has announced a new battery cell design solution that combines Fraunhofer ITWM’s electro-chemical simulation technology with Hexagon’s multi-physics material simulation and metrology software to significantly accelerate new battery cell research and development programmes.
TMCS1123 by Texas Instruments
The TMCS1123 is a galvanically isolated Hall-effect current sensor with industry leading isolation and accuracy. An output voltage proportional to the input current is provided with excellent linearity and low drift at all sensitivity options.
RELEC new EIRE300 open frame AC-DC power supply
Relec Electronics has announced the release of the EIRE300 series from Vox Power, a powerful addition to its high efficiency AC-DC power supply range designed to meet the rigorous needs of both medical and industrial applications.
KIOXIA's UFS recognised with award
KIOXIA Europe recently announced its industry’s first Universal Flash Storage (UFS) Ver. 4.0 of embedded flash memory devices for automotive applications was awarded in the Memory & Storage category of the Embedded Computing Design (ECD) electronica Best in Show Awards at the electronica 2024.
Parker Chromerics releases new thermal gap filler
The Chromerics Division of Parker Hannifin Corporation has released THERM-A-FORM CIP 60, a high-performance cure-in-place material and thermal gap filler that offers 6.0 W/m-K thermal conductivity.
Pickering introduces compact reed relay
Pickering Electronics has introduced its latest high-density reed relay, the Series 125 - reportedly the industry's smallest two pole DPST (double-pole, single-throw) reed relay, switching up to 1 Amp, 20 Watts, while stacking on a compact 5mm x 5mm pitch.
Siemens announces next-gen AI software
Siemens Digital Industries Software recently announced the latest advancement in its electronic systems design portfolio: the next generation release takes an integrated and multidisciplinary approach, combining Xpedition software, Hyperlynx software and PADS Profesional software into a unified user experience.
Compact DC/DC converters meet small footprint demand
TDK has released the FS series of µPOL DC-DC converters. Samples and evaluation boards are available at Anglia Components.