Search results for "skills gap"

ITT Interconnect Solutions is now offering modified versions of its Field Attachable Power Connectors so they may be used in place of splices for joining downhole power cables for electric submersible pumps, saving time and money. BIW Power Cable Connectors (PCCs) can save significant rig time, increasing efficiency and lowering costs. If installed on cables before they are delivered to the well site, the savings are even greater. These fiel...

The Power Sources Manufacturers Association has announced the publication of the 2009 PSMA Power Technology Roadmap . This report is the sixth in a series done every three years to look at the technology trends in power technology over the next four to five years. In 2008, leaders from the key groups - end users, power supply manufacturers and component suppliers - got together to present, compare and discuss their views on the trends in power t...

Kontron announced its newly defined Computer-on-Module (COM) standard for their upcoming ultra low-power embedded architecture platform family. Releasing its new COM standard marks a significant milestone in Kontron's recently announced strategic entry into the ARM market. The new COM standard features a slim form factor designed for the company's future ultra low-power, off-the-shelf platforms, including: embedded handheld devices and rugged tab...

Kontron announced its strategic entry into ARM architecture, enabling a new breed of embedded scalable building blocks for application-ready platforms with low-power consumption. The first products planned for 2011 will be in the module and board form factors. Under development at Kontron is a new module format, optimized for usage with ARM System-On-Chip processor types. The modules will enable ARM processors, single, dual and quad core, to be u...

Power supply maker TDK-Lambda UK, a subsidiary of the TDK Corporation in Japan, celebrates 50 years of design and manufacture this November. The presentation of a commemorative plaque was made by Yoshiaki Hirota, General Manager (SPS Division) TDK-Lambda Corporation of Japan, to UK Directors during his recent visit to the Ilfracombe design and manufacturing facility.

Rapid Electronics has expanded its stock of Bergquist thermal management products to include high performance insulators, adhesives, gap filling and interface materials. With over 40 years experience, Bergquist are market-leading manufacturers of products that manage heat in electronic circuits, particularly around semiconductors. Whether at the design stage or at full production thermal interface materials are required for heat reduction and ins...

A new calibration service for high-frequency AC power measurements is now being offered by Yokogawa Europe through its Calibration Centre in Amersfoort, The Netherlands. Based on the development of Yokogawa’s WT3000 precision power analyser the Yokogawa Europe calibration service offers power calibration at DC and AC from 0.1 Hz to 100 kHz. This calibration is traceable to international standards by the accredited NMi (Nederlands Meetinstituut)...

The introduction of Mother Goose Mortgages to the community of Southborough in Tunbridge Wells has not gone unnoticed thanks to a novel egg-shaped digital display screen in its high-street window. Vikuiti Rear Projection film from 3M, the diversified technology company, has been installed as part of a brand awareness exercise managed by digital print and design specialists bootdesign Limited. The mortgage broker represents the first permanent non...

Clare Instruments, part of the Seaward Group, has recently upgraded its bespoke custom electrical test design service for manufacturers of electrical and electronic products. Clare has developed a broad range of fully programmable electrical safety and functional test instruments that can be adapted and integrated for use in bespoke test systems, using proprietry software such as LabView.

Data Modul now offers value added LCD display solutions featuring performance enhancing glass bonding technology from Hitachi . By using an optical adhesive and a cost effective lamination process a glass substrate is bonded directly to the front of the TFT LCD module. The bonding process ensures that there is no air gap between the glass substrate and the display. The use of glass optical bonding technology coupled with an enhanced anti-refle...