Search results for "tvs array"
Imec and ASML demonstrate potential of 193nm immersion lithography with freeform illumination
Imec and ASML collaborated to qualify ASML’s Tachyon Source Mask Optimization and programmable illuminator system FlexRay™, proving its potential with the demonstration of a 22nm SRAM memory cell. In October 2010, the ASML XT:1900i lithography scanner at imec will be equipped with FlexRay™, enabling imec to step ahead and further explore the ultimate frontiers of immersion lithography.
California Micro Devices Claims Industry's Smallest ESD Protection Device for Mobile Handsets
California Micro Devices announced the CM1242-33CP, first in a family of extremely small outline ESD (electrostatic discharge) protection devices. Establishing new industry benchmarks for ESD performance and small solution form factor, the CM1242 is an ideal solution for space constrained applications in multimedia smart phones, netbooks and MIDs (mobile internet devices), e-book readers and personal media players. The device provides a single c...
Wireless experts say the signal is clear for whitespace
Cambridge Consultants today highlighted three applications ripe for innovation and market growth due to the newly freed whitespace spectrum: rural broadband provisioning; municipal wireless networks; and in-home media distribution. The United States Federal Communications Commission (FCC) recently released the final rules for whitespace radio devices, freeing up unlicensed bands to the public. Those highly desirable “super Wi-Fi” whitespace ...
Silicon Frontline Announces First Commercial 3D Hierarchical Extractor
Silicon Frontline Technology, Inc. (SFT), an Electronic Design Automation (EDA) company, in the post-layout verification market focused on solutions for nanometer design applications, announced today that it is introducing the industry’s first commercial hierarchical 3D extractor, H3D, for post-layout verification. H3D offers hierarchical parasitic extraction, hierarchical netlisting, unlimited capacity, and field-solver accuracy. H3D works wit...
Introducing the latest thing for the PCI Express bus
Scientific plc is pleased to announce the introduction of two new digital I/O boards for the PCI Express Bus by Measurement Computing.
Measurement Computing extends its range of ruggedised USB data acquisition devices
Adept Scientific extends its range of USB-based data acquisition devices from Measurement Computing Corporation.
Solar-powered Cloud Instrument™ sends data to real-time data-brokerage platform
A recent application of the Cores Electronic Tag4M sensor tag, available from Adept Scientific illustrates two new uses for this credit-card sized device which delivers its data directly to a targeted website through any commercially available access point or wireless router.
Telsonic UK Seal the Case for Siemens
With a presence within the United Kingdom for 32 years, Telsonic UK Limited has been involved in a multitude of applications across a diverse range of industries and has subsequently acquired enviable levels of process and application knowledge. When Siemens presented the challenge of achieving an IP54 rated welded joint on an inverter operator panel, which incorporated sensitive electronics, Telsonic were once again able to demonstrate their abi...
Telsonic ultrasonic modules energise cleaning applications
Telsonic has been present within the UK market since 1977. Since then, the comprehensive range of high quality ultrasonic products available from the company has enabled Telsonic to build up a strong UK customer base. Telsonic UK Limited will further consolidate this position with their participation in the Surface World Show 2009, to be held at the NEC between the 27th and 29th October 2009.
Field Precision Releases Xenos: Software Suite for X-ray Simulation
Field Precision LLC today announced the release of Xenos(TM) (X-ray/Electron Numerical Optimization Suite), an integrated suite of advanced 2D/3D finite-element programs for simulating X-ray and electron devices. Component programs calculate electric fields, magnetic fields, charged-particle dynamics, electron-photon-positron transport in materials and thermal transport.