Search results for "LASER COMPONENTS"

At this week’s IEEE RFIC Symposium, imec, a global pioneering research and innovation hub in nanoelectronics and digital technologies, presents a state-of-the-art CMOS-based beamforming transmitter for D-band wireless applications.

Yole Group has provided a comprehensive review of UWB technologies, highlighting and comparing the solutions implemented in smartphones by leading companies, Apple (with their internal U2 module), Samsung (with SR200 solution from NXP), and Google (with DW35725 solution from Qorvo).

Junkosha is set to present its range of high-frequency cabling solutions at the IEEE MTT International Microwave Symposium (IMS) 2024.

Samsung Electro-Mechanics has introduced the CL32B104KHU6PN#, a high-voltage multi-layer ceramic capacitor (MLCC) tailored for electric vehicle applications such as DC/DC converters.

Resolution can be defined as the number of distinct elements that a sensor can capture, i.e., the sensor’s ability to distinguish between two closely spaced points. It is specified in pixels.

In this article, Electronic Specifier’s Paige West discusses Apple repairability and how the company’s policies align with the Right to Repair movement.

The FLEXPOINTMVmicro series was developed for standalone machine vision applications primarily in use together with industrial cameras in 3D measurements.

Housing the highest light intensity is fundamental in machine vision applications.

In this article, Manoj Rajashekaraiah, Principal Engineer, Analog Devices will provide an overview of the components that constitute an industrial robot/cobot.

Infineon Technologies introduces the 600V CoolMOS 8 high voltage superjunction (SJ) MOSFET product family.