Search results for "ASIC"

On Stand 279 in Hall 5 at the Embedded World exhibition in Nuremberg, SWINDON Silicon Systems will be highlighting the advantages of System on Chip (SoC) and System in Package (SiP) solutions as part of ASIC development and production. Already renowned for its design expertise and experience in the supply of mixed signal ASICs, the company has seen a dramatic increase in the number of companies approaching them for more complex ASIC systems.

Pico Technology will be giving a technical presentation at HW/Expo 2016, a UK conference for hardware engineers. Entitled 'Flexible Resolution Oscilloscopes Address Mixed Domain Application Challenges', the presentation will explore how a single instrument can now meet the demands of both analogue and digital engineers.

Cortus and Aspen Logic announce an educational webinar on creating ASICs for IoT & M2M products. The presentation entitled 'Attention IoT Developers: Yes, your Things can stand out!' will run live at 10:00a.m. PST/ 6:00 p.m. GMT on 16th February 2016.

IDT's next-gen RapidIO switches deliver the ultra-low latency, high bandwidth and superior energy efficiency needed for the development of 4G LTE-A and 5G wireless infrastructure systems. The RXS switch family delivers greater than twice the performance of IDT’s previous-gen switches and are also suited for applications with intensive bandwidth and low latency requirements such as mobile edge computing, high-performance computing and data a...

Microsemi have announced that they will be giving a technical presentation at HW/Expo, a hardware developers’ conference taking place near Cambridge, UK, in April 2016. Peter Trott, a Senior FAE at Microsemi will explain and demonstrate SmartFusion2, a System-On-Chip device that is being widely used to ensure network security in industrial, military and medical systems.

EtherCAT implementation complexity and cost can be reduced with the XMC4300 microcontroller series of Infineon Technologies. Without compromise to EtherCAT communication features, the XMC4300 has been specifically developed for cost-sensitive industrial applications that also make high demands on design flexibility, connectivity and real-time performance.

Lattice Semiconductor Corporation has announced an expansion of the company’s ECP5 family of low power, small form factor connectivity and acceleration FPGAs. These new additions are pin compatible with ECP5 FPGAs and enable OEMs to seamlessly update their designs to meet evolving interface requirements in the industrial, communications and consumer markets.

Barco Silex has validated its hardware solution for lightweight, low complexity video compression against the SMPTE 2042-3 reference. The low footprint core is now ready to be integrated in both ASIC and FPGA designs without the need for an expensive footprint. This opens up new possibilities for equipment manufacturers as they get a low cost, interoperable compression solution to upgrade video transport to high definition formats such as UHD and...

VadaTech has announced the AMC595, an Advanced Mezzanine Card or AdvancedMC (AMC) based on the Xilinx Virtex UltraScale XCVU440 FPGA, arguably the highest performance FPGA available today. Aimed at compute-intensive applications such as large scale ASIC prototyping and emulation, the AMC595 builds on VadaTech’s successful portfolio of products based on Xilinx UltraScale FPGAs.

Banner Engineering introduces its new M18-4 self-contained photoelectric sensors. Featuring robust IP69K-rated 316 stainless steel housing, the heavy-duty 18 mm metal barrel sensor is ideal for harsh industrial environments where abrasive chemicals and ingress fluid are present. Built with Advanced ASIC (Application Specific Integrated Circuit) technology, the dc-operated M18-4 sensors are also resistant to fluorescent light and offer a high leve...