Search results for "skills gap"
Agilent Technologies Adds Bit Error Ratio Analysis Capabilities to Optical Modulation Analyzer
Agilent Technologies has announced it has added bit error ratio (BER) capabilities to its optical modulation analyzer. Agilent will demonstrate the new BER test feature on a polarization multiplexed signal at ECOC 2009 Vienna, Austria, booth 666, Sept. 21-23.
Sheffield hospital uses JAOtech Smart Terminals to access Electronic Medical Records
JAOtech Smart Terminals form the interface of an innovative system that delivers electronic patient records to the bedside at The Children’s Hospital, Sheffield. Delivered by ANS Group in partnership with Provision Network, a division of Quest Software, the system is to be rolled out across all 140 bedside terminals at the hospital, as well as other computers used by clinical staff at nursing stations and in offices.
Agilent's VME/VXS Digitizer Targets Programs for Defence Market
Agilent Technologies has introduced a VME/VXS module that simultaneously provides wide input signal bandwidth and dynamic range. The SVM3500 is a quad-channel 12-bit digitizer allowing channel interleaving to provide sampling up to 2 GS/s. With more than 2 GHz analog bandwidth, the module is ideal for applications in radar, Electronic Warfare (EW) and Synthetic Instrumentation (SI).
Agilent Technologies Appoints Ambry Genetics as First Certified Service Provider for Agilent's Target Enrichment System for Next-Gen Sequencing
Agilent Technologies and Ambry Genetics today announced that Ambry is the first organization to achieve Certified Service Provider (CSP) status for Agilent's SureSelect Target Enrichment System for next-generation sequencing. SureSelect, introduced in February 2009, has been shown to greatly increase the speed and cost-efficiency of next-generation sequencing workflows used in life science research by enabling experiments to focus on genomic reg...
Freescale updates plans for Sendai fabrication facility
After completing the assessment of its Sendai, Japan wafer fabrication facility following the recent earthquake, Freescale Semiconductor today announced that it will not reopen the seriously damaged facility.
Agilent Technologies' New LTE Applications Target 4G System-Level Designers
Agilent Technologies introduced a new line of system-level design and verification products for 3GPP LTE physical layer (PHY) design at Mobile World Congress 2010. In addition to its traditional test and measurement products, Agilent now provides predictive products and algorithmic references for the SystemVue platform that are consistent with the LTE v.8.9.0 (December 2009) standard. The new line includes four products that accelerate 4G deploy...
LDRA Boosts Automation and Transparency of Test Process
LDRA has extended TBmanager, a test management and traceability component within the LDRA tool suite. With the adoption of process-oriented standards such as IEC 62304, IEC 61508:2010 and ISO/DIS 26262, software developers must comply with programming standards and provide requirements traceability. To ease compliance and requirements traceability, TBmanager has been extended to deliver greater transparency, implement consistent test plans throug...
LDRA Opens Direct R&D, Sales and Support in India
LDRA, the leading provider of automated software verification, source code analysis, and test tools, today announced the opening of an office in Bangalore, India. As the eleventh largest world economy, India has become a cornerstone in LDRA’s growth strategy. LDRA will provide research and development, front-line sales and technical support to customers in key markets such as aerospace, defense, nuclear, rail, consulting, and education/researc...
Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Costs
Undetected bonding pressure variations can result in poor or open flip chip connections, reducing yield and long-term reliability while raising costs. Maintaining a uniform distribution of bonding pressure across a flip chip die assures chip to substrate coplanarity, optimal bump compression, and a controlled, reproducible die to substrate gap. Pressurex pressure indicating sensor film is a valuable assist to today’s flip chip bonders which l...
Semtech & Microchip Launch Wireless Remote Keyless Entry System
Semtech Corp. (NASDAQ: SMTC), a leading supplier of analog and mixed-signal semiconductors, and Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, analog and Flash-IP solutions, today announced the availability of a reference design that provides a turnkey platform for highly secure, low-power, multi-band wireless remote keyless entry (RKE) systems. This new reference design integrates Semtech’s high-performance tr...