Search results for "SiC MOSFET"
electronica 2022: Avnet Abacus, Mornsun sign disti pact
Avnet Abacus announced a new supplier agreement with power products supplier MORNSUN at electronica 2022 in Munich.
Advantest showcases latest semiconductor test solutions
Semiconductor test equipment supplier Advantest will showcase their diverse portfolio of test solutions at SEMICON Europa, on November 15th to 18th in Munich.
Latest GaN FET doubles power density in small form factor, says EPC
GAN power FET and IC provider, Efficient Power Conversion (EPC) launches the EPC2619, its latest GaN FET.
New digital hot-swap and system monitoring controller IC
Infineon introduces the wide voltage range hot-swap controller with a programmable digital SOA control for data centres.
DIAMFAB unveils new strategy and technology vision
DIAMFAB, astartup innovator of high value-addeddiamond semiconductor wafer technology for next-generation electronics, announced that thecompany will move to a new dual business model strategy.
Automotive ASFETs enhance airbag systems
Mouser Electronics is now shipping the BUK9Mx and BUK9Yx automotive ASFETs for airbag applications fromNexperia.
Navitas – GaNSense Half-Bridge power IC
GaNSense power ICs use next-generation gallium nitride (GaN) to replace silicon chips to enable 3x faster charging and 3x more power in half the size and weight for mobile chargers.
EVs expected to reinforce the demand for silicon carbide
As per a report published by Fact.MR, the global silicon carbide market is poised to grow at a CAGR of 17% from 2022 to 2032.
Exciting demos at onsemi’s booth at electronica
onsemi’s booth at electronica will feature exciting demos covering automotive, industrial and cloud power for electric vehicles, advanced safety, factory automation, energy infrastructure and EV charging – with silicon carbide (SiC) technology heavily featured.
Infineon QDPAK and DDPAK registered as JEDEC standard
The trends toward higher power density and cost optimisation dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies today announced it has successfully registered its QDPAK and DDPAK top-side cooling (TSC) packages, which are ideal for high-voltage MOSFETs as a JEDEC standard.