Search results for "Master Bond"
Optimised copper ribbon for laser bonding
Heraeus Electronics announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg.
Innovative bonding technologies for numerous applications
Bondexpo is regarded as a leading trade fair for bonding technology and is an important venue for companies involved in industrial dispensing and attaching.
Wi-Fi 7 – A huge step forward for networking
While Wi-Fi 6E has not been out for long in the grand scheme of things, the next generation – often referred to as IEEE 802.11be or simply ‘Wi-Fi 7’ is soon to arrive.
Awards of the PCIM Europe Conference 2022 announced
The annual award ceremony at the PCIM Europe Conference has traditionally been honouring outstanding contributions and promoting young talents in the power electronics industry since 2008.
Drama as helicopter sensor flies into theatre role
With theatres striving to create breath-taking spectacles and leave the audience gasping for more, there is often world-class engineering behind the scenes. A British company is developing technology to ensure safety when excited performers and heavy machinery share the same space.
Industry first for last mile deliveries
Renault Trucks has announced the launch of an industry-first multimodal last mile e-mobility concept.
2Excel Aviation and IAI's Maritime Heron demonstrated
2Excel Aviation and IAI (Israel Aerospace Industries) have completed a demonstration of IAI's Maritime Heron UAS, or unmanned aircraft system, in a series of live, Beyond Visual Line of Sight maritime search and ISR – intelligence, surveillance, reconnaissance – scenarios. The demonstration was based out of West Wales Airport in Aberporth, Wales.
AI smart sensor suits wearables and hearables
The BHI260AP self-learning AI smart sensor from Bosch is in stock at distributor Mouser Electronics.
Eutelsat & OneWeb to combine
Eutelsat Communications (Euronext Paris: ETL) and key OneWeb shareholders have signed a Memorandum of Understanding with the objective of creating a leading global player in connectivity through the combination of both companies in an all-share transaction.
congatec introduces COM-HPC carrier board
congatec has introduced its first modular Micro-ATX compliant carrier board with COM-HPC interface.