Search results for "IBM"

NXP announced its intent to make its JenNet-IP ultra-low-power, IEEE 802.15.4-based wireless connectivity network layer software available under an Open Source license, as part of its vision to enable the “Internet of Things.”

ARM, Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and Synopsys today announced the delivery of the industry’s first complete vertically optimized 32/28 nanometer (nm) design platform. Demonstrating the strength of the collaboration established and announced at DAC a year ago, the companies are collectively providing a technology enablement solution for the design and manufacturing of advanced mobile and embedded devices.

austriamicrosystems' Full Service Foundry business unit today released its further expanded fast and cost-efficient ASIC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, with an even more extensive schedule in 2011. The service, which combines several designs from different customers onto one wafer offers significant cost advantages for foundry customers as the costs for wafer and masks are shared among a number of differen...

In a move that addresses fundamental challenges in creating advanced systems-on-chips (SoCs), ARM, Chartered Semiconductor Manufacturing Ltd. , IBM, Samsung Electronics, Co., Ltd., and Synopsys, Inc. (Nasdaq: SNPS) today announced at the Design Automation Conference (DAC) an agreement to develop a comprehensive technology enablement solution for the design and manufacture of mobile Internet-optimized devices. The objective of this collaboration i...

Bridgelux Inc., a leading developer and manufacturer of LED lighting technologies and solutions, has announced that David W. Plumer, Jr. has joined the company in the newly created global role of Chief Sales & Marketing Officer. Plumer brings to his new position more than 30 years of multinational Sales, Marketing, Operations, and General Management experience across the Information Technology, Clean Technology, and Energy Management industries....

In a joint effort to secure the future of Altis Semiconductor and its employees, IBM (NYSE:IBM) and Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today closed a transaction to sell 100% of the share capital of Altis Semiconductor to the new corporation Altis International. IBM and Infineon said this completes the divestment of their joint venture Altis Semiconductor in France.

CST has today announced the launch of a new product that analyzes PCBs with respect to EMC and SI related design rules. Design engineers dealing with electromagnetic compatibility and signal integrity of PCBs, can now employ CST BOARDCHECK to get a quick overview of potential problems in their layout.

LSI Corporation announced it has achieved 1 million random read input/output operations per second (IOPS) using a 4K block size in a PCI Express (PCIe)-based solid-state storage (SSS) performance demonstration running in a single server. The demo showcases the improved price-to-performance ratio, lower power consumption and increased storage density offered by new LSI PCIe SSS cards compared to storage solutions utilizing hard disk drives (HDDs).

Distributed Management Task Force, Inc. (DMTF), the organization bringing the IT industry together to collaborate on systems management standards development, validation, promotion and adoption, today announced that Huawei, a leader in providing next-generation telecommunications network solutions around the world, has been elected to the DMTF Board of Directors.

Cadence Design Systems today introduced a qualified 32/28-nanometer reference flow targeting Common Platform technology. Cadence® collaborated closely with members of the Common Platform alliance—IBM, GLOBALFOUNDRIES, and Samsung Electronics—to develop a comprehensive flow from RTL synthesis to GDSII signoff for the advanced node, low-power high-k metal gate (HKMG) process technology.