Search results for "HyRel Technologies"
HARAKAN VPX rugged compact mission computer
Kontron has introduced the new HARAKAN-F, a compact mission computer providing high-density processing and powerful GPGPU for AI computing.
PCIM Europe 2024: the highlights
With PCIM Europe 2024 now behind us, what better time to look back at the trends, innovations, and discussions happening within the power electronics industry.
Navitas explores what’s next for GaN at PCIM 2024
At PCIM 2024 on the Navitas booth, the company was excited to show off its new portfolio of next-generation SiC and GaN solutions for fast charging, motor drives, power conversion and storage, and beyond. To learn more, Electronic Specifier’s Harry Fowle spoke with Llew Vaughan-Edmunds, Senior Director of Product Management (SiC, GaN) at Navitas, who shared his insights in the latest GaN innovations.
Researchers develop world's first chip-based 3D printer
Imagine a portable 3D printer that could fit in the palm of your hand, enabling the rapid creation of customised, low-cost objects on the go.
SCHURTER launches new connectors
Following the launch of the first 400 VDC connectors (GP21 and GS21) in accordance with IEC TS 62735, SCHURTER has now introduced models GC21 and GH21/GI21 on the device side, ensuring full IEC compliance.
Zebra to showcase machine vision at Battery Show
Zebra Technologies will showcase its machine vision hardware and software solutions at the Battery Show Europe from 18-20 June in Stuttgart, Germany.
London Tech Week: Invest in people as much as tech
Investing in people as much as new technology was emphasised in various talks, panels and presentations that were held at London Tech Week from 10-12 June, which invited back innovators, investors and tech companies to share ideas and innovation.
All-weather global shutter Ethernet camera for outdoor applications
e-con Systems introduces a new Outdoor-Ready Global Shutter GigE camera – RouteCAM_CU25, the addition to its high performance Ethernet camera series, RouteCAM.
Infineon reinforces its SiC vision at PCIM 2024
At PCIM 2024 on the Infineon booth, Electronic Specifier’s Harry Fowle got to speak with Peter Friedrichs, VP of SiC at Infineon, to learn about Infineon’s focus within the SiC market.
Siemens collaborates with Samsung Foundry
Siemens Digital Industries Software announced that, in collaboration with Samsung Foundry, it has developed new capabilities for manufacturing multi-die packaged designs at advanced nodes.