Search results for "skills gap"

Of the several RF connectors available for interconnections in wireless remote radio heads, repeaters, base stations, GPS devices, and similar applications, the board-to-board connector is growing in popularity. The product line has evolved from accommodating limited misalignment to offering the widest tolerances available.

Radiall and Molex Incorporated have announced that Molex is now a licensed second source for Radiall SMP-MAX board-to-board coaxial connectors. As a second source, Molex will manufacture and market the connectors.

Anritsu Corporation, a leading manufacturer of test and measurement equipment, today announced a joint demonstration with Altair Semiconductor, a 4G chip company developing the world’s most advanced mobile semiconductors for handheld devices, focused on the development of LTE solutions.

Anritsu are delighted to announce the appointment of Trescal as its sole certified service partner in France. This certification means that Trescal will be providing OEM backed calibration and repair services on Anritsu products via their network of labs through-out the country. Anritsu will be directly supporting Trescal, as an integral part of this relationship, to ensure the continuing high quality service support of Anritsu products for their...

Ada-Europe, the international organisation that promotes the knowledge and use of the Ada programming language in European academia, research and industry, is pleased to announce The Ada Way. This annual student programming contest aims to attract students and educators to Ada in a form that is both fun and instructive. Entries are now open for the 2010-11 competition and judging takes place in May next year.

Lauterbach announced the opening of a new technical support center in Shenzhen, China. This new office is in addition to the existing offices in Beijing and Suzhou and has been found to be necessary due the size of the Chinese territory.

Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Innofidei Inc., a leading mobile chipset provider based in Beijing, China, has successfully taped out the industry’s first long-term evolution time division duplex (LTE-TDD, or TD-LTE) baseband chip supporting a bandwidth of 20MHz for the next-generation TD-CDMA wireless communications protocol. The TD-LTE design achieved first-pas...

Cadence Design Systems has released Cadence Encounter Digital Implementation (EDI) System 9.1, a complete and integrated digital design, implementation, and verification environment for the development of large-scale, complex SoCs. The new and expanded suite of capabilities in EDI System 9.1 answers the industry call for improved designer productivity in developing advanced low power and mixed signal SoCs at leading-edge process nodes – such as...

Cadence Design Systems announced that three additional universities will take on active roles in its academic network in Europe. The network promotes the proliferation of leading-edge technologies and methodologies at universities renowned for their engineering and design excellence. The latest additions to the Cadence Academic Network are the CETTI/TU Bucharest, which will focus on PCB design; the KTH Stockholm, which will concentrate on wireles...

Accton Technology Corporation, a Taiwanese global telecommunications equipment company and LG-Nortel, a Korean global telecommunications solution provider , today announced that they signed an agreement to form a joint venture that will offer voice and data solutions for North American small and medium businesses (SMBs) and large enterprises.