Search results for "silicon motion"
SiC FET lowers conduction losses
Wide Band Gap Devices like Silicon Carbide (SiC) Field Effect Transistors (FETs) are more and more considered for High-Voltage and High Power applications because of the capability of higher switching frequencies and thus better efficiency than common Silicon FETs.
Edge AI and vision processing in low power envelop
Congatec, a vendor of embedded and edge computing technology, has announced the launch of its latest SMARC module 2.1 Computer-on-Modules based on Texas Instruments Jacinto 7 TDA4x or DRA8x processors.
Pre-order the latest Raspberry Pi 5 boards from Farnell
The much-anticipated new Raspberry Pi 5 4GB and 8GB boards will be available for pre-order from Farnell, Raspberry Pi’s exclusive global licensee, on 29th September.
Over 500 investors back dementia-fighting SmartSocks
Over 500 investors have pledged to back an inventor’s SmartSocks – a technology that could transform care for people with dementia and non-verbal autism.
e-con Systems launches HDR multi-camera solution for NVIDIA Jetson Orin
e-con Systems, with over two decades of experience in designing, developing, and manufacturing OEM cameras, has recently launched STURDeCAM31 – a 3MP GMSL2 HDR IP69K camera powered by Sony ISX031 sensor for NVIDIA Jetson AGX Orin.
Eben Upton introduces Raspberry Pi 5
Launching at the end of October, Raspberry Pi 5 comes with new features, is over twice as fast as its predecessor, and is the first one to feature silicon designed in-house at Cambridge, UK.
Keysight, Synopsys, and Ansys accelerate RFIC semiconductor design
Keysight Technologies, Synopsys, and Ansys announced a new reference flow for the TSMC N4PRF, the semiconductor foundry’s advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.
HORIBA MIRA opens driving simulator centre
Automotive engineering, test and development consultancy HORIBA MIRA has launched its new Driving Simulator Centre at its UK head office in Nuneaton, Warwickshire.
Microchip’s 28-nm SuperFlash embedded flash memory
GlobalFoundries (GF) and Microchip Technology, via Microchip’s Silicon Storage Technology (SST) subsidiary, announce the immediate release to production of the SST ESF3 third-generation embedded SuperFlash technology NVM solution in the GF 28SLPe foundry process.
Cadence expands support for 3Dblox 2.0 standard
Cadence Design Systems has announced the availability of new system prototyping flows based on the Cadence Integrity 3D-IC Platform that support the 3Dblox 2.0 standard.