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As PCIM 2024 kicks off, addressing SiC & GaN test & measurement (T&M) concerns is one of the many topics taking centre stage, with companies like Rohde & Schwarz revealing new products that address these problems.

This user's guide introduces the TPS563252EVM and TPS563257EVM. These two devices differ in their light load behavior. The TPS563252 operates in Eco-mode and the TPS563257 operates in FCCM mode. This user's guide contains information for the TPS563252 and TPS563257 as well as support documentation for the TPS563252EVM and TPS563257EVM evaluation modules

Due to the effects of over-farming and extreme weather events, such as drought, wind, or flooding, the demand for significant technological intervention becomes ever more pressing across countless nonarable and depleted areas of land worldwide.

Applications such as Hot-swap where Power FET is operated in saturation region under high stress, FET safe operating area (SOA) is a major concern for system designers. Designers need to study the FET SOA curve available in the manufacturers data sheet and determine if the FET can handle the power stress without undergoing damage. This application report covers the significance of FET SOA, how the manufacturers derive SOA plot, and how the hot-sw...

Rohde & Schwarz will showcase its latest solutions for power electronics testing at PCIM Europe in Nuremberg (June 11 to 13).

The TLV709 low-dropout (LDO) linear voltage regulator is a low quiescent current device that offers the benefits of a wide input voltage range and low-power operation in miniaturized packaging. The TLV709 is optimized to power microcontrollers and other low power loads for battery-powered applications.

X-FAB and Soitec are set to collaborate on offering Soitec’s SmartSiC wafers for the production of silicon carbide power devices at the former's facility in Lubbock, Texas.

The predecessor of the recently developed GRS550 flying probe test system not only set high test standards in the electronics industry, but also proved to be economical and very easy to operate.

X-FAB (Euronext Paris), a global pure-play foundry pioneer serving a large variety of fabless customers, and Soitec (Euronext Paris), one of the leaders in designing and manufacturing innovative semiconductor materials, will begin work to offer Soitec’s SmartSiC wafers for the production of silicon carbide power devices at X-FAB’s plant in Lubbock, Texas.

The concept of a self-driving car has taken the world by storm. Here Simran Khokha, Product Manager at Infineon Technologies, delves into the crucial development of next-generation chips for self driving cars, detailing their reliance on advanced semiconductors and sensors to ensure enhanced performance, safety, and comfort across various levels of vehicle automation.