Search results for "miniaturisation"

Suitable for different package types, making them versatile, flexible and universal, Yamaichi Electronics has announced the IC561, IC564 and NP584 series test solution sockets. The miniaturisation and integration process of state-of-the art IC components is leading the major electronics manufacturers to use many different package solutions. For the multitude of different package types there is often no standard solution available.

Going into space is now within your grasp. A tiny spacecraft being developed at Arizona State University is breaking the barrier of launch cost, making the price of conducting a space mission radically cheaper.

Researchers in Singapore are using 'nanoantennae' to manipulate light beams. This may open the door to the development of new light-based technologies, such as display screens, and in energy harvesting and data transmission. It would allow, for example, the miniaturisation of traditional optical components, such as lenses, polarizers or beam-splitters, to nanoscale sizes.

The computerisation of manufacturing, or what is commonly referred to as Industry 4.0, is changing the way we work in the 21st century as smart technologies become increasingly integral to factory processes and supply chain automation.

Glass thinner than a human hair is now strong and flexible enough to be used in a wide variety of high-tech applications. The technology group SCHOTT is one of the few companies in the world that develops and manufactures ultra-thin glass for cutting-edge features in smartphones of the future, including cover glasses, substrates for flexible OLED displays and wearables, camera systems, novel micro batteries, processors and fingerprint and bio-sen...

Designed for single-cell battery applications such as smartphones, ROHM announces theBD1865GWL compact, high-efficiency, high power synchronous boost DC/DC converter IC.

Thirty-five ambitious Scottish technology companies are heading for one of the world’s largest technology trade shows, Mobile World Congress, to grab a bigger slice of the ($3 trillion) global mobile technology market after a record year in raising equity finance.

Unlike conventional mobile phones, smartphones are no longer primarily communication devices, but also tools for entertainment and work. Users run more and more applications in parallel, their smartphones constantly need to boost their performance. At Mobile World Congress in Barcelona, Infineon Technologies will present new solutions that make smartphones more powerful and more energy-efficient.

Physicists at the Technical University of Munich (TUM) have developed a nanolaser, a thousand times thinner than a human hair. Thanks to an ingenious process, the nanowire lasers grow right on a silicon chip, making it possible to produce high-performance photonic components cost-effectively. This will pave the way for fast and efficient data processing with light in the future.

The industrial engineer Iñaki Cornago-Santos has developed structures on a nanometric scale that can be used as biosensors for medical, food or environmental sectors to detect diseases, allergens or contaminants; or can be used to reduce the reflection of solar cells in order to increase their efficiency. This is what he says in his PhD thesis defended at the NUP/UPNA-Public University of Navarre.