Search results for "Engineers Without Borders"

Telonic Instruments is bringing a new range of high-performance oscilloscopes from Siglent to the UK.

Selectivesolderingof assemblies on panels is generally straightforward, but when working with large panels containing tall components, the task becomes more complex.

Ispringen, September 2024 – Rutronik has expanded its product lineup with the VOMDA1271 from Vishay, a MOSFET driver designed specifically for the automotive industry. Certified to AEC-Q102 standards, this optically isolated driver boasts an integrated fast turn-off feature and operates without the need for an external power supply. By drawing all necessary power from the infrared emitter on the low-voltage primary side, the VOMDA1271 elimi...

NordsonTEST & INSPECTION announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry.

On 4th September 2024,Silicon Labsannounced support forBluetooth Channel Soundingtechnology on its xG24 platform, marking a significant step forward in Bluetooth Low Energy (LE) ranging capabilities.

Kongsberg Discovery is pleased to announce a significant milestone in the development of its AUV HUGIN Endurance, following a record-setting, fully autonomous multi-week mission.

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are used to create tinyelectrical connectionsbetween a semiconductor chip and other components.

Chipolo, a creator ofBluetooth item trackingsolutions, is excited to announce a series of fresh partnerships withMetabo,iodyne, andKnirps.

Nordic Semiconductor has announced the availability of its smallest and lowest power System-in-Package (SiP) - the nRF9151, and its associated nRF9151 Development Kit (DK).

u-blox and Wireless Logic have announced a strategic partnership aimed at enhancing the capabilities of IoT devices through Wireless Logic’s IoT network, Conexa, and u-blox’s advanced cellular modules.