Search results for "AMD"

AMD today announced the new AMD Embedded G-Series System-on-Chip platform, a single-chip solution based on the AMD next-generation “Jaguar” CPU architecture and AMD Radeon 8000 Series graphics. The new AMD Embedded G-Series SOC platform further signifies a strategic push to focus on high-growth markets outside the PC industry, with an emphasis on embedded systems. The announcement was made at this year’s DESIGN West expo.

NEXCOM's high-end video wall player, NDiS B862, is designed to drive multiple displays for digital-out-of-home (DOOH) applications. The video wall player provides superior graphic performance to display immersive visuals at 6K x 2K resolution on tiled displays. Equipped with six HDMI display outputs, NDiS B862 can seamlessly stretch the image and video across six displays. NDiS B862 also has the durability, the functionality and the right interfa...

Hectronic has announced an industrial operating temperature range (-40°C till +85°C) version of the existing product H6059, a CPU module based on AMD Embedded G-Series APUs. An APU is a combination of a low-power CPU and an advanced graphics processing unit integrated into a single embedded device.

NEXCOM digital signage player, NDiS 165, is a surefire solution for multi-screen display deployments. Powered by the latest AMD Embedded R-series APU integrated with Radeon HD 7000 Graphics engine, NDiS 165 supports DirectX 11 and provides accelerated yet power-efficient graphics processing performance and video encoding features.

The TPC-1840WP and 2140WP and are 18” and 21” widescreen multitouch panel PCs, specifically designed to provide easier operation and boost productivity in manufacturing control environments, building automation and other HMI applications.

Unlike the relatively close annual market growth relationship between fabless IC suppliers and foundries, fabless IC company sales growth versus IDM (integrated device manufacturer) IC supplier growth has typically been very different (Figure 1).

Later this month, IC Insights’ May Update to The 2013 McClean Report will show a ranking of the top 25 semiconductor suppliers in 1Q13. A preview of the top 20 companies is listed in Figure 1. The top 20 worldwide semiconductor (IC and O S D—optoelectronic, discrete, and sensor) sales leaders for 1Q13 include nine suppliers headquartered in the U.S., four in Japan, three in Europe, and two each in South Korea and Taiwan, a relatively broad re...

AAEON today expands its line of ultra-slim EPIC form factor boards with the release of the EPC-CV1. At only 20.84mm thick (26mm with our reference heat sink), this compact SBC helps to maximize spatial efficiency in embedded systems.

congatec extends its COM Express product range with processors from the AMD Embedded G-Series SoC family. This single-chip solution is based on AMD technology and integrates the next-generation computing power of the “Jaguar” based processor and AMD Radeon graphics cores in a compact package.

MSC Vertriebs announce the availability of a new Qseven Starter Kit based on MSC’s Qseven modules featuring the AMD Embedded G-Series Accelerated Processing Units. The MSC Q7-SK-A50M-EP4 Starter Kit consists of MSC’s 3.5” Qseven baseboard Q7-MB-EP4 with suitable heatspreader and heatsink and an integrated power supply with cable kit. The kit comes with a ready-to-run Linux installation in Flash Disk to enable an out-of-the-box functional ex...